Parametric results for: cs132 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 150 STANDARD: UL 94V-0 200

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1.4 inch 648

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0.095 inch 108 0.12 inch 120 0.13 inch 120 0.165 inch 300

Min (inch) - Max (inch)

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1.4 inch 648

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13X13 90 14X14 558

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AU 71 AU ON NI 96 GOLD OVER NICKEL 120 NOT APPLICABLE 5 NOT SPECIFIED 14 SN-PB 36 SN-PB ON NI 80 TIN LEAD OVER NICKEL 130

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Gold (Au) - with Nickel (Ni) barrier 209 GOLD OVER NICKEL 105 TIN LEAD OVER NICKEL 92 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 242

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Contact Material (5)

BE-CU 283 BERYLLIUM COPPER 44 BERYLLIUM COPPER ALLOY 206 BRASS 12 NOT SPECIFIED 7

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RND PIN-SKT 648

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IC SOCKET 648

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PGA132 633 PGA192 15

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GLASS FILLED EPOXY 12 GLASS FILLED THERMOPLASTIC 276 POLYBUTYLENE TEREPHTHALATE 80 POLYPHENYLENE SULFIDE 80 THERMOPLASTIC POLYESTER 200

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e0 334 e4 314

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Manufacturer (1)

Advanced Interconnections Corp 648

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0.1 inch 648

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STRAIGHT 648

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Number of Contacts (1)

132 648

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140.0 °C 216 150.0 °C 30 260.0 °C 222

Min (°C) - Max (°C)

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-60.0 °C 468

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RECTANGULAR 648

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100 µm 648

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Obsolete 648

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No 552

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Terminal Pitch (1)

2.54 mm 648

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SOLDER 648

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