Parametric results for: cs1135 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 3 STANDARD: UL 94V-0 4

8 hits Apply

1.1 inch 8

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0.13 inch 8

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1.1 inch 8

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11X11 8

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AU ON NI 2 GOLD OVER NICKEL 2 SN-PB ON NI 2 TIN LEAD OVER NICKEL 2

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Gold (Au) - with Nickel (Ni) barrier 4 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 4

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Contact Material (2)

BE-CU 4 BERYLLIUM COPPER ALLOY 4

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RND PIN-SKT 8

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IC SOCKET 8

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PGA113 4 PGA193 4

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GLASS FILLED THERMOPLASTIC 4 THERMOPLASTIC POLYESTER 4

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e0 4 e4 4

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Manufacturer (1)

Advanced Interconnections Corp 8

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0.1 inch 8

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STRAIGHT 8

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Number of Contacts (1)

113 8

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140.0 °C 4 150.0 °C 1 260.0 °C 3

Min (°C) - Max (°C)

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-60.0 °C 8

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RECTANGULAR 8

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100 µm 8

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Obsolete 8

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No 8

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Terminal Pitch (1)

2.54 mm 8

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SOLDER 8

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