Filter Your Search
1 - 10 of 29 results
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CDLL5519B
Microchip Technology Inc
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CDLL5519A
Microchip Technology Inc
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CDLL5519
Microchip Technology Inc
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CDLL5519A/TR
Microchip Technology Inc
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CDLL5519B/TR
Microchip Technology Inc
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CDLL5519E3
Microchip Technology Inc
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CDLL5519BE3
Microchip Technology Inc
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CDLL5519E3/TR
Microchip Technology Inc
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CDLL5519BE3/TR
Microchip Technology Inc
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CDLL5519C
Microchip Technology Inc
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| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Other | ||||||||||||||||||||||||||||||||
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Composite Price
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Rohs Code
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Part Life Cycle Code
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Working Test Current
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Reverse Current-Max
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Power Dissipation-Max
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Reference Voltage-Nom
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Diode Element Material
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Diode Type | Polarity | Configuration |
Surface Mount
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Number of Elements | Technology |
Additional Feature
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Dynamic Impedance-Max
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Reverse Test Voltage
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Voltage Tol-Max
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Qualification Status
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JESD-30 Code
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JESD-609 Code
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JEDEC-95 Code
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Case Connection
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Number of Terminals
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Package Body Material
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Package Shape
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Package Style
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Terminal Finish
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Terminal Form
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Terminal Position
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Ihs Manufacturer
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Package Description
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Reach Compliance Code
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| No | Active | 20 mA | 3 µA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant | |||
| No | Active | 20 mA | 3 µA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 900 mV | 10 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant | ||||
| No | Active | 20 mA | 3 µA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 900 mV | 20 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant | ||||
| Active | 20 mA | 3 µA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 900 mV | 10 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | ||||||
| Active | 20 mA | 3 µA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | |||||
| Active | 20 mA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 20 % | O-LELF-R2 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, LEADLESS, GLASS, LL34, MELF-2 | compliant | |||||||||||||
| Active | 20 mA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | O-LELF-R2 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, LEADLESS, GLASS, LL34, MELF-2 | compliant | |||||||||||||
| Active | 20 mA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 20 % | O-LELF-R2 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | ||||||||||||||
| Yes | Active | 20 mA | 3 µA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | 5 % | O-LELF-R2 | DO-213AA | 175 °C | -65 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant | ||||
| No | Active | 20 mA | 3 µA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | 2 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant |
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CDLL5519B
Microchip Technology Inc
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$6.6796 Buy | No | Active | 20 mA | 3 µA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant | ||||
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CDLL5519A
Microchip Technology Inc
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$6.6796 Buy | No | Active | 20 mA | 3 µA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 900 mV | 10 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant | |||||
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CDLL5519
Microchip Technology Inc
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$6.6796 Buy | No | Active | 20 mA | 3 µA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 900 mV | 20 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant | |||||
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CDLL5519A/TR
Microchip Technology Inc
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$6.8688 Buy | Active | 20 mA | 3 µA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 900 mV | 10 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | |||||||
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CDLL5519B/TR
Microchip Technology Inc
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$6.8688 Buy | Active | 20 mA | 3 µA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | ||||||
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CDLL5519E3
Microchip Technology Inc
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$6.8688 Buy | Active | 20 mA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 20 % | O-LELF-R2 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, LEADLESS, GLASS, LL34, MELF-2 | compliant | ||||||||||||||
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CDLL5519BE3
Microchip Technology Inc
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$6.8688 Buy | Active | 20 mA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | O-LELF-R2 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, LEADLESS, GLASS, LL34, MELF-2 | compliant | ||||||||||||||
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CDLL5519E3/TR
Microchip Technology Inc
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$7.0617 Buy | Active | 20 mA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 20 % | O-LELF-R2 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | |||||||||||||||
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CDLL5519BE3/TR
Microchip Technology Inc
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$7.0617 Buy | Yes | Active | 20 mA | 3 µA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | 5 % | O-LELF-R2 | DO-213AA | 175 °C | -65 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant | |||||
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CDLL5519C
Microchip Technology Inc
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$13.7321 Buy | No | Active | 20 mA | 3 µA | 500 mW | 3.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | 2 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant |