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1 - 10 of 17 results
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CDLL3027
Microsemi Corporation
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$9.5676 | No | No | Transferred | 12.5 mA | 1 W | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 20 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AB | HERMETIC SEALED, GLASS, LL41, MELF-2 | 2 | unknown | EAR99 | 8541.10.00.50 | |||||
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CDLL3027A
Microsemi Corporation
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$9.5676 | No | No | Transferred | 12.5 mA | 1 W | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 10 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AB | HERMETIC SEALED, GLASS, LL41, MELF-2 | 2 | unknown | EAR99 | 8541.10.00.50 | |||||
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CDLL3027B
Microsemi Corporation
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$9.5676 | No | Transferred | 12.5 mA | 1 W | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, LL41, MELF-2 | unknown | ||||||||||
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CDLL3027
Microchip Technology Inc
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$15.7689 | No | Active | 12.5 mA | 1 W | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 20 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL41, MELF-2 | compliant | ||||||||||
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CDLL3027A
Microchip Technology Inc
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$15.7689 | No | Active | 12.5 mA | 1 W | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 10 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL41, MELF-2 | compliant | ||||||||||
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CDLL3027B
Microchip Technology Inc
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$15.7689 | No | Active | 12.5 mA | 1 W | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL41, MELF-2 | compliant | Microchip | |||||||||
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CDLL3027E3
Microsemi Corporation
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Check for Price | Transferred | 12.5 mA | 1 W | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 20 % | O-LELF-R2 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.50 | ||||||||||||
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CDLL3027A
Compensated Devices Inc
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Check for Price | Transferred | 12.5 mA | 500 nA | 1 W | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 750 Ω | 10 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | COMPENSATED DEVICES INC | HERMETIC SEALED, GLASS, LL41, MELF-2 | unknown | |||||||||
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CDLL3027B/TR
Microsemi Corporation
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Check for Price | Transferred | ZENER DIODE | MICROSEMI CORP | unknown | |||||||||||||||||||||||||||||||||||||
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CDLL3027CE3
Microsemi Corporation
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Check for Price | Transferred | 12.5 mA | 1 W | 20 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 2 % | O-LELF-R2 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.50 |