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Parametric results for: cat93c6633ua30te13 under Other uPs/uCs/Peripheral ICs

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Manufacturer Part Number: cat93c6633ua30te13

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Select Parts		Part Number

		CAT93C6633UA-30TE13 Catalyst Semiconductor
		CAT93C6633UA-30TE13 onsemi

				Most Relevant			Technical				Compliance			Operating Conditions			Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

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Transferred

YES

5 V

MICROPROCESSOR CIRCUIT

CMOS

6 V

2.7 V

INDUSTRIAL

S-PDSO-G8

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN LEAD

GULL WING

650 µm

DUAL

1.1 mm

3 mm

CATALYST SEMICONDUCTOR INC

SOIC

TSSOP,

unknown

8542.31.00.01

Check for Price

Obsolete

YES

5 V

MICROPROCESSOR CIRCUIT

CMOS

6 V

2.7 V

INDUSTRIAL

S-PDSO-G8

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN LEAD

GULL WING

650 µm

DUAL

1.1 mm

3 mm

ON SEMICONDUCTOR

SOIC

TSSOP-8

compliant

8542.31.00.01

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CAT93C6633UA-30TE13

Catalyst Semiconductor

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Transferred

YES

5 V

MICROPROCESSOR CIRCUIT

CMOS

6 V

2.7 V

INDUSTRIAL

S-PDSO-G8

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN LEAD

GULL WING

650 µm

DUAL

1.1 mm

3 mm

CATALYST SEMICONDUCTOR INC

SOIC

TSSOP,

unknown

8542.31.00.01

CAT93C6633UA-30TE13

onsemi

Check for Price

Obsolete

YES

5 V

MICROPROCESSOR CIRCUIT

CMOS

6 V

2.7 V

INDUSTRIAL

S-PDSO-G8

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN LEAD

GULL WING

650 µm

DUAL

1.1 mm

3 mm

ON SEMICONDUCTOR

SOIC

TSSOP-8

compliant

8542.31.00.01