Parametric results for: bzv55c18 under Zener Diodes
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BZV55C18
Luguang Electronic Technology Co Ltd
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$0.0143 | Active | MINIMELF | MINIMELF | |||||||||||||||||||||||||||||||||||||||||||||
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BZV55C18
DC Components Co Ltd
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$0.0214 | Contact Manufacturer | DC COMPONENTS CO LTD | MELF-2 | unknown | ||||||||||||||||||||||||||||||||||||||||||||
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BZV55-C18,115
Nexperia
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$0.0290 | Yes | Active | 5 mA | 400 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | O-LELF-R2 | e3 | IEC-60134 | 1 | 200 °C | -65 °C | 260 | 30 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN | WRAP AROUND | END | MELF | SOD80C | NEXPERIA | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | 2 | EAR99 | 8541.10.00.50 | 1991-04-01 | Nexperia | |||||||||
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BZV55-C18,135
Nexperia
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$0.0426 | Yes | Active | 5 mA | 400 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | O-LELF-R2 | e3 | IEC-60134 | 1 | 200 °C | -65 °C | 260 | 30 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN | WRAP AROUND | END | MELF | SOD80C | NEXPERIA | compliant | 2 | EAR99 | 8541.10.00.50 | Nexperia | |||||||||||
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BZV55C18
SPC Multicomp
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$0.0627 | Active | 5 mA | 400 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | O-LELF-R2 | 200 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MULTICOMP PRO | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | 2 | EAR99 | 8541.10.00.50 | |||||||||||||||||||||
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BZV55C18-TP
Micro Commercial Components
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$0.1154 | Yes | Yes | Obsolete | 5 mA | 100 pA | 500 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY | 50 Ω | 170 Ω | Not Qualified | O-LELF-R2 | e3 | 1 | 150 °C | -55 °C | 260 | 10 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Matte Tin (Sn) | WRAP AROUND | END | MELF | MICRO COMMERCIAL COMPONENTS | O-LELF-R2 | compliant | 2 | EAR99 | 8541.10.00.50 | ||||||||
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BZV55C18
Microchip Technology Inc
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$3.0431 | Active | 5 mA | 500 mW | 18 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 6.41 % | O-LELF-R2 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LEADLESS, LL34, MELF-2 | compliant | Microchip | ||||||||||||||||||||
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BZV55C188
HY Electronic Corp
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Check for Price | Contact Manufacturer | ZENER DIODE | HY ELECTRONIC CORP | unknown | EAR99 | 8541.10.00.50 | ||||||||||||||||||||||||||||||||||||||||||
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BZV55C18TRL13
YAGEO Corporation
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Check for Price | Obsolete | PHILIPS COMPONENTS | O-LELF-R2 | unknown | EAR99 | 8541.10.00.50 | ||||||||||||||||||||||||||||||||||||||||||
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BZV55C18-B0L1G
Taiwan Semiconductor
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Check for Price | Yes | Active | e3 | 1 | MATTE TIN OVER NICKEL | TAIWAN SEMICONDUCTOR CO LTD | compliant | EAR99 | 8541.10.00.50 |