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Manufacturer Part Number: bga777l7e6327xtsa1

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	Part Number

BGA777L7E6327XTSA1

Infineon Technologies AG

			Most Relevant	Technical			Compliance	Operating Conditions				Physical									Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Telecom IC Type	Number of Functions	Temperature Grade	JESD-30 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code

Check for Price

Yes

Obsolete

2.8 V

RF AND BASEBAND CIRCUIT

OTHER

R-XBCC-B6

85 °C

-30 °C

NOT SPECIFIED

UNSPECIFIED

HVBCC

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

YES

BUTT

500 µm

BOTTOM

1.3 mm

2 mm

500 µm

INFINEON TECHNOLOGIES AG

2 X 1.30 MM, 0.39 MM HEIGHT, GREEN, TSLP-6

compliant

8542.39.00.01

Compare

BGA777L7E6327XTSA1

Infineon Technologies AG

Check for Price

Yes

Obsolete

2.8 V

RF AND BASEBAND CIRCUIT

OTHER

R-XBCC-B6

85 °C

-30 °C

NOT SPECIFIED

UNSPECIFIED

HVBCC

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

YES

BUTT

500 µm

BOTTOM

1.3 mm

2 mm

500 µm

INFINEON TECHNOLOGIES AG

2 X 1.30 MM, 0.39 MM HEIGHT, GREEN, TSLP-6

compliant

8542.39.00.01