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Parametric » Power Circuits » Power Management Circuits

Parametric results for: bd2200gu under Power Management Circuits

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Select Parts		Part Number

		BD2200GUL-E2 ROHM Semiconductor
		BD2200GUL ROHM Semiconductor

				Most Relevant							Technical			Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Supply Current-Max (Isup)	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Yes

Yes

Active

3.3 V

2.7 V

5.5 V

30 µA

1

YES

NO

LOAD SWITCH

1

OTHER

R-PBGA-B6

Not Qualified

85 °C

-25 °C

NOT SPECIFIED

NOT SPECIFIED

6

PLASTIC/EPOXY

VFBGA

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1 mm

1.5 mm

550 µm

ROHM CO LTD

BGA

1.50 X 1 MM, VCSP-6

6

compliant

EAR99

8542.39.00.01

ROHM Semiconductor

Check for Price

Yes

Yes

Active

3.3 V

2.7 V

5.5 V

1

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

OTHER

R-PBGA-B6

e1

Not Qualified

85 °C

-25 °C

260

NOT SPECIFIED

6

PLASTIC/EPOXY

VFBGA

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

1 mm

1.5 mm

550 µm

ROHM CO LTD

BGA

VFBGA,

6

compliant

EAR99

8542.39.00.01

Compare

ROHM Semiconductor

Yes

Yes

Active

3.3 V

2.7 V

5.5 V

30 µA

1

YES

NO

LOAD SWITCH

1

OTHER

R-PBGA-B6

Not Qualified

85 °C

-25 °C

NOT SPECIFIED

NOT SPECIFIED

6

PLASTIC/EPOXY

VFBGA

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1 mm

1.5 mm

550 µm

ROHM CO LTD

BGA

1.50 X 1 MM, VCSP-6

6

compliant

EAR99

8542.39.00.01

ROHM Semiconductor

ROHM Semiconductor

Check for Price

Yes

Yes

Active

3.3 V

2.7 V

5.5 V

1

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

OTHER

R-PBGA-B6

e1

Not Qualified

85 °C

-25 °C

260

NOT SPECIFIED

6

PLASTIC/EPOXY

VFBGA

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

1 mm

1.5 mm

550 µm

ROHM CO LTD

BGA

VFBGA,

6

compliant

EAR99

8542.39.00.01