Filter Your Search
1 - 10 of 12 results
|
AX250-2CQG352M
Microchip Technology Inc
|
Check for Price | Yes | Active | 1.5 V | 250000 | 2816 | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | MILITARY | SQUARE | CMOS | 2816 CLBS, 250000 GATES | 1.575 V | 1.425 V | S-CQFP-F352 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 352 | CERAMIC, METAL-SEALED COFIRED | QFF | TPAK352,2.9SQ,20 | SQUARE | FLATPACK | YES | FLAT | 500 µm | QUAD | 48 mm | 48 mm | 2.89 mm | MICROCHIP TECHNOLOGY INC | 0.50 MM PITCH, ROHS COMPLIANT, CERAMIC, QFP-352 | compliant | 3A001.A.2.C | 8542.39.00.01 | ||||
|
AX250-2CQG352M
Microsemi Corporation
|
Check for Price | Yes | Transferred | 1.5 V | 250000 | 2816 | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | MILITARY | SQUARE | CMOS | 2816 CLBS, 250000 GATES | 1.575 V | 1.425 V | S-CQFP-F352 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 352 | CERAMIC, METAL-SEALED COFIRED | QFF | TPAK352,2.9SQ,20 | SQUARE | FLATPACK | YES | FLAT | 500 µm | QUAD | 48 mm | 48 mm | 2.89 mm | MICROSEMI CORP | QFF, | compliant | 3A001.A.2.C | 8542.39.00.01 | ||||
|
AX250-2CQG208M
Microsemi FPGA & SoC
|
Check for Price | Transferred | 1.5 V | 250000 | 2816 | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | MILITARY | SQUARE | CMOS | 2816 CLBS, 250000 GATES | 1.575 V | 1.425 V | S-CQFP-F208 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 208 | CERAMIC, METAL-SEALED COFIRED | QFF | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | YES | FLAT | 500 µm | QUAD | 29.21 mm | 29.21 mm | 3.3 mm | MICROSEMI SOC PRODUCTS GROUP | QFF, | unknown | 3A001.A.2.C | 8542.39.00.01 | QFP | 208 | |||
|
AX250-2CQ352M
Microsemi Corporation
|
Check for Price | Transferred | 1.5 V | 250000 | 2816 | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | MILITARY | SQUARE | CMOS | 2816 CLBS, 250000 GATES | 1.575 V | 1.425 V | S-CQFP-F352 | Not Qualified | 125 °C | -55 °C | 352 | CERAMIC, METAL-SEALED COFIRED | QFF | TPAK352,2.9SQ,20 | SQUARE | FLATPACK | YES | FLAT | 500 µm | QUAD | 48 mm | 48 mm | 2.89 mm | MICROSEMI CORP | QFF, | compliant | 3A001.A.2.C | 8542.39.00.01 | |||||||
|
AX250-2CQG208M
Microsemi Corporation
|
Check for Price | Yes | Transferred | 1.5 V | 250000 | 2816 | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | MILITARY | SQUARE | CMOS | 2816 CLBS, 250000 GATES | 1.575 V | 1.425 V | S-CQFP-F208 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 208 | CERAMIC, METAL-SEALED COFIRED | QFF | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | YES | FLAT | 500 µm | QUAD | 29.21 mm | 29.21 mm | 3.3 mm | MICROSEMI CORP | QFF, | compliant | 3A001.A.2.C | 8542.39.00.01 | ||||
|
AX250-2CQ208M
Microsemi Corporation
|
Check for Price | Transferred | 1.5 V | 250000 | 2816 | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | MILITARY | SQUARE | CMOS | 2816 CLBS, 250000 GATES | 1.575 V | 1.425 V | S-CQFP-F208 | Not Qualified | 125 °C | -55 °C | 208 | CERAMIC, METAL-SEALED COFIRED | QFF | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | YES | FLAT | 500 µm | QUAD | 29.21 mm | 29.21 mm | 3.3 mm | MICROSEMI CORP | QFF, | compliant | 3A001.A.2.C | 8542.39.00.01 | |||||||
|
AX250-2CQ352M
Microchip Technology Inc
|
Check for Price | Active | 1.5 V | 250000 | 2816 | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | MILITARY | SQUARE | CMOS | 2816 CLBS, 250000 GATES | 1.575 V | 1.425 V | S-CQFP-F352 | Not Qualified | 125 °C | -55 °C | 352 | CERAMIC, METAL-SEALED COFIRED | QFF | TPAK352,2.9SQ,20 | SQUARE | FLATPACK | YES | FLAT | 500 µm | QUAD | 48 mm | 48 mm | 2.89 mm | MICROCHIP TECHNOLOGY INC | 0.50 MM PITCH, CERAMIC, QFP-352 | compliant | 3A001.A.2.C | 8542.39.00.01 | |||||||
|
AX250-2CQ208M
Microsemi FPGA & SoC
|
Check for Price | Transferred | 1.5 V | 250000 | 2816 | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | MILITARY | SQUARE | CMOS | 2816 CLBS, 250000 GATES | 1.575 V | 1.425 V | S-CQFP-F208 | Not Qualified | 125 °C | -55 °C | 208 | CERAMIC, METAL-SEALED COFIRED | QFF | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | YES | FLAT | 500 µm | QUAD | 29.21 mm | 29.21 mm | 3.3 mm | MICROSEMI SOC PRODUCTS GROUP | QFF, | unknown | 3A001.A.2.C | 8542.39.00.01 | QFP | 208 | |||||
|
AX250-2CQG208M
Microchip Technology Inc
|
Check for Price | Yes | Active | 1.5 V | 250000 | 2816 | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | MILITARY | SQUARE | CMOS | 2816 CLBS, 250000 GATES | 1.575 V | 1.425 V | S-CQFP-F208 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 208 | CERAMIC, METAL-SEALED COFIRED | QFF | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | YES | FLAT | 500 µm | QUAD | 29.21 mm | 29.21 mm | 3.3 mm | MICROCHIP TECHNOLOGY INC | 0.50 MM PITCH, ROHS COMPLIANT, CERAMIC, QFP-208 | compliant | 3A001.A.2.C | 8542.39.00.01 | ||||
|
AX250-2CQ352M
Microsemi FPGA & SoC
|
Check for Price | Transferred | 1.5 V | 250000 | 2816 | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | MILITARY | SQUARE | CMOS | 2816 CLBS, 250000 GATES | 1.575 V | 1.425 V | S-CQFP-F352 | Not Qualified | 125 °C | -55 °C | 352 | CERAMIC, METAL-SEALED COFIRED | QFF | TPAK352,2.9SQ,20 | SQUARE | FLATPACK | YES | FLAT | 500 µm | QUAD | 48 mm | 48 mm | 2.89 mm | MICROSEMI SOC PRODUCTS GROUP | QFF, | unknown | 3A001.A.2.C | 8542.39.00.01 | QFP | 352 |