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AM29SL160CB150WCI
Spansion
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Check for Price | No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 2 V | 150 ns | FLASH | 16 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 1.8 V | 2.2 V | 1.8 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 240 | 30 | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 8 mm | SPANSION INC | BGA | TFBGA, | 48 | compliant | |||||||||||||||||||
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AM29SL160CB-150WCI
AMD
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Check for Price | No | Transferred | 16.7772 Mbit | 16 | 8K,64K | 1MX16 | 2 V | 150 ns | FLASH | 20 YEAR DATA RETENTION | 8 | BOTTOM | YES | YES | YES | 20 | 1 | 8,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 5 µA | 30 µA | 2.2 V | 1.8 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 8 mm | ADVANCED MICRO DEVICES INC | BGA | TFBGA, BGA48,6X8,32 | 48 | unknown | EAR99 | 8542.32.00.51 | ||||||
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AM29SL160CB-150WCI
Cypress Semiconductor
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Check for Price | No | Active | 16.7772 Mbit | 8K,64K | 1MX16 | 2 V | 2 V | 150 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 8,31 | 1000000 | 1.0486 M | PARALLEL | YES | 5 µA | 30 µA | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | CYPRESS SEMICONDUCTOR CORP | compliant | |||||||||||||||||||||||
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AM29SL160CB-150WCI
Spansion
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Check for Price | No | Obsolete | 16.7772 Mbit | 16 | 8K,64K | 1MX16 | 2 V | 150 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 1 | 8,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 5 µA | 30 µA | 2.2 V | 1.8 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 8 mm | SPANSION INC | BGA | 8 X 9 MM, 0.80 MM PITCH, FBGA-48 | 48 | not_compliant | EAR99 | 8542.32.00.51 | ||||||
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AM29SL160CB150WCI
AMD
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Check for Price | Transferred | 16.7772 Mbit | 8 | 2MX8 | 2 V | 150 ns | FLASH | 16 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 1.8 V | 2.2 V | 1.8 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 8 mm | ADVANCED MICRO DEVICES INC | BGA | TFBGA, | 48 | unknown | |||||||||||||||||||||||||
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AM29SL160CB-150WCIN
Spansion
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Check for Price | No | Obsolete | 16.7772 Mbit | 16 | 1MX16 | 2 V | 150 ns | FLASH | 8 | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 1.8 V | 2.2 V | 1.8 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 8 mm | SPANSION INC | BGA | 8 X 9 MM, 0.80 MM PITCH, FBGA-48 | 48 | compliant | EAR99 | 8542.32.00.51 |