Findchips: Parametric Search Results for am29lv642du35pae

Parametric results for: am29lv642du35pae under Flash Memories

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		AM29LV642DU90RPAF Spansion
		AM29LV642DU12RPAE AMD
		AM29LV642DU12RPAI Spansion
		AM29LV642DU12RPAE Spansion
		AM29LV642DU90RPAI Spansion
		AM29LV642DU90RPAI AMD
		AM29LV642DU12RPAI AMD
		AM29LV642DU12RPAK Spansion
		AM29LV642DU12RPAF Spansion
		AM29LV642DU12RPAE Cypress Semiconductor

				Most Relevant							Technical																					Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Power Supplies	Access Time-Max	Memory IC Type	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3.3 V

90 ns

FLASH

BOTTOM/TOP

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

134.2177 Mbit

32K

8MX16

3.3 V

120 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

YES

10 µA

30 µA

3.6 V

3 V

CMOS

MILITARY

YES

NOR TYPE

R-PBGA-B64

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

13 X 11 MM, 1 MM PITCH, FBGA-64

unknown

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

134.2177 Mbit

32K

8MX16

3.3 V

120 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

YES

10 µA

30 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

not_compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

134.2177 Mbit

32K

8MX16

3.3 V

120 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

YES

10 µA

30 µA

3.6 V

3 V

CMOS

MILITARY

YES

NOR TYPE

R-PBGA-B64

Not Qualified

125 °C

-55 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

not_compliant

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

134.2177 Mbit

32K

8MX16

3.3 V

90 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

YES

10 µA

30 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

not_compliant

EAR99

8542.32.00.51

Check for Price

Transferred

134.2177 Mbit

32K

8MX16

3.3 V

90 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

YES

10 µA

30 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

13 X 11 MM, 1 MM PITCH, FBGA-64

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

134.2177 Mbit

32K

8MX16

3.3 V

120 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

YES

10 µA

30 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

13 X 11 MM, 1 MM PITCH, FBGA-64

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3.3 V

120 ns

FLASH

BOTTOM/TOP

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

MILITARY

NOR TYPE

R-PBGA-B64

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

compliant

3A001.A.2.C

8542.32.00.51

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3.3 V

120 ns

FLASH

BOTTOM/TOP

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

compliant

EAR99

8542.32.00.51

Check for Price

Active

134.2177 Mbit

32K

8MX16

3.3,3/5 V

120 ns

FLASH

YES

256

8000000

8.3886 M

PARALLEL

YES

10 µA

30 µA

CMOS

MILITARY

YES

NOR TYPE

S-PBGA-B64

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

BGA

BGA64,8X8,40

SQUARE

GRID ARRAY

YES

BALL

1 mm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

Compare

AM29LV642DU90RPAF

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3.3 V

90 ns

FLASH

BOTTOM/TOP

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

compliant

EAR99

8542.32.00.51

AM29LV642DU12RPAE

AMD

Check for Price

Transferred

134.2177 Mbit

32K

8MX16

3.3 V

120 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

YES

10 µA

30 µA

3.6 V

3 V

CMOS

MILITARY

YES

NOR TYPE

R-PBGA-B64

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

13 X 11 MM, 1 MM PITCH, FBGA-64

unknown

3A001.A.2.C

8542.32.00.51

AM29LV642DU12RPAI

Spansion

Check for Price

Obsolete

134.2177 Mbit

32K

8MX16

3.3 V

120 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

YES

10 µA

30 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

not_compliant

EAR99

8542.32.00.51

AM29LV642DU12RPAE

Spansion

Check for Price

Obsolete

134.2177 Mbit

32K

8MX16

3.3 V

120 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

YES

10 µA

30 µA

3.6 V

3 V

CMOS

MILITARY

YES

NOR TYPE

R-PBGA-B64

Not Qualified

125 °C

-55 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

not_compliant

3A001.A.2.C

8542.32.00.51

AM29LV642DU90RPAI

Spansion

Check for Price

Obsolete

134.2177 Mbit

32K

8MX16

3.3 V

90 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

YES

10 µA

30 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

not_compliant

EAR99

8542.32.00.51

AM29LV642DU90RPAI

AMD

Check for Price

Transferred

134.2177 Mbit

32K

8MX16

3.3 V

90 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

YES

10 µA

30 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

13 X 11 MM, 1 MM PITCH, FBGA-64

unknown

EAR99

8542.32.00.51

AM29LV642DU12RPAI

AMD

Check for Price

Transferred

134.2177 Mbit

32K

8MX16

3.3 V

120 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

YES

10 µA

30 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

13 X 11 MM, 1 MM PITCH, FBGA-64

unknown

EAR99

8542.32.00.51

AM29LV642DU12RPAK

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3.3 V

120 ns

FLASH

BOTTOM/TOP

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

MILITARY

NOR TYPE

R-PBGA-B64

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

compliant

3A001.A.2.C

8542.32.00.51

AM29LV642DU12RPAF

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3.3 V

120 ns

FLASH

BOTTOM/TOP

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.7 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

compliant

EAR99

8542.32.00.51

AM29LV642DU12RPAE

Cypress Semiconductor

Check for Price

Active

134.2177 Mbit

32K

8MX16

3.3,3/5 V

120 ns

FLASH

YES

256

8000000

8.3886 M

PARALLEL

YES

10 µA

30 µA

CMOS

MILITARY

YES

NOR TYPE

S-PBGA-B64

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

BGA

BGA64,8X8,40

SQUARE

GRID ARRAY

YES

BALL

1 mm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant