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Manufacturer Part Number: am29lv640du101r
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AM29LV640DU101RWHIN
 AMD 		Check for Price No Transferred 67.1089 Mbit 16 32K 4MX16 3.3 V 100 ns FLASH YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 30 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B63 Not Qualified e0 85 °C -40 °C 63 PLASTIC/EPOXY TFBGA BGA63,8X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM 1.2 mm 12 mm 11 mm ADVANCED MICRO DEVICES INC BGA 11 X 12 MM, 0.80 MM PITCH, FBGA-63 63 unknown EAR99 8542.32.00.51
AM29LV640DU101RWHF
 Cypress Semiconductor 		Check for Price Yes Active 67.1089 Mbit 32K 4MX16 2/2.5,3.3 V 100 ns FLASH YES YES YES 128 4000000 4.1943 M PARALLEL YES 5 µA 30 µA CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B63 Not Qualified 85 °C -40 °C 63 PLASTIC/EPOXY FBGA BGA63,8X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM CYPRESS SEMICONDUCTOR CORP compliant
AM29LV640DU101RPCI
 Spansion 		Check for Price No No Obsolete 67.1089 Mbit 16 32K 4MX16 3.3 V 100 ns FLASH BOTTOM/TOP YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 30 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e0 3 85 °C -40 °C 260 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, FBGA-64 64 not_compliant EAR99 8542.32.00.51
AM29LV640DU101RWHF
 Spansion 		Check for Price Yes Obsolete 67.1089 Mbit 16 32K 4MX16 3.3 V 100 ns FLASH BOTTOM/TOP YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 30 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B63 Not Qualified e1 3 85 °C -40 °C 260 40 63 PLASTIC/EPOXY TFBGA BGA63,8X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 12 mm 11 mm SPANSION INC BGA 12 X 11 MM, 0.80 MM PITCH, LEAD FREE, FBGA-63 63 unknown EAR99 8542.32.00.51
AM29LV640DU101RWHI
 Spansion 		Check for Price No Obsolete 67.1089 Mbit 16 32K 4MX16 3.3 V 100 ns FLASH BOTTOM/TOP YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 30 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B63 Not Qualified e0 3 85 °C -40 °C 260 63 PLASTIC/EPOXY TFBGA BGA63,8X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 12 mm 11 mm SPANSION INC BGA 12 X 11 MM, 0.80 MM PITCH, FBGA-63 63 not_compliant EAR99 8542.32.00.51
AM29LV640DU101RPCIN
 Cypress Semiconductor 		Check for Price Active 67.1089 Mbit 32K 4MX16 2/2.5,3.3 V 100 ns FLASH YES YES YES 128 4000000 4.1943 M PARALLEL YES 5 µA 30 µA CMOS INDUSTRIAL YES NOR TYPE S-PBGA-B64 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY BGA BGA64,8X8,40 SQUARE GRID ARRAY YES BALL 1 mm BOTTOM CYPRESS SEMICONDUCTOR CORP compliant
AM29LV640DU101RPCI
 Cypress Semiconductor 		Check for Price No Active 67.1089 Mbit 32K 4MX16 2/2.5,3.3 V 100 ns FLASH YES YES YES 128 4000000 4.1943 M PARALLEL YES 5 µA 30 µA CMOS INDUSTRIAL YES NOR TYPE S-PBGA-B64 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY BGA BGA64,8X8,40 SQUARE GRID ARRAY YES BALL 1 mm BOTTOM CYPRESS SEMICONDUCTOR CORP compliant
AM29LV640DU101RWHI
 Cypress Semiconductor 		Check for Price No Active 67.1089 Mbit 32K 4MX16 2/2.5,3.3 V 100 ns FLASH YES YES YES 128 4000000 4.1943 M PARALLEL YES 5 µA 30 µA CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B63 Not Qualified 85 °C -40 °C 63 PLASTIC/EPOXY FBGA BGA63,8X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM CYPRESS SEMICONDUCTOR CORP compliant
AM29LV640DU101RWHIN
 Cypress Semiconductor 		Check for Price Active 67.1089 Mbit 32K 4MX16 2/2.5,3.3 V 100 ns FLASH YES YES YES 128 4000000 4.1943 M PARALLEL YES 5 µA 30 µA CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B63 Not Qualified 85 °C -40 °C 63 PLASTIC/EPOXY FBGA BGA63,8X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM CYPRESS SEMICONDUCTOR CORP compliant
AM29LV640DU101RWHFN
 Spansion 		Check for Price Yes Obsolete 67.1089 Mbit 16 4MX16 3.3 V 100 ns FLASH BOTTOM/TOP 1 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B63 Not Qualified e1 3 85 °C -40 °C 63 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 12 mm 11 mm SPANSION INC BGA 12 X 11 MM, 0.80 MM PITCH, LEAD FREE, FBGA-63 63 compliant EAR99 8542.32.00.51
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