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AM29LV400BB55RWAD
AMD
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Check for Price | Yes | Transferred | 4.1943 Mbit | 16 | 16K,8K,32K,64K | 256KX16 | 3.3 V | 55 ns | FLASH | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1,2,1,7 | 256000 | 262.144 k | PARALLEL | YES | 5 µA | 30 µA | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 70 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA48,6X8,32 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||
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AM29LV400BB55RWAD
Spansion
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Check for Price | Yes | Obsolete | 4.1943 Mbit | 16 | 16K,8K,32K,64K | 256KX16 | 3.3 V | 55 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1 | 1,2,1,7 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 70 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 8.15 mm | 6.15 mm | SPANSION INC | TFBGA, BGA48,6X8,32 | unknown | EAR99 | 8542.32.00.51 | BGA | 48 | ||
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AM29LV400BB-55RWAD
Spansion
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Check for Price | Yes | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 3 V | 55 ns | FLASH | CONFIGURABLE AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PBGA-B48 | Not Qualified | e3 | 70 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | MATTE TIN | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | TFBGA, | compliant | BGA | 48 |