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AM29LV160BT70RWCD
Spansion
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Check for Price | Yes | Obsolete | 16.7772 Mbit | 16 | 16K,8K,32K,64K | 1MX16 | 3.3 V | 70 ns | FLASH | TOP BOOT BLOCK | 8 | TOP | YES | YES | YES | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 70 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 8 mm | SPANSION INC | BGA | 8 X 9 MM, 0.80 MM PITCH, FBGA-48 | 48 | compliant | EAR99 | 8542.32.00.51 | ||||
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AM29LV160BT-70RWCD
AMD
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Check for Price | Yes | Transferred | 16.7772 Mbit | 16 | 16K,8K,32K,64K | 1MX16 | 3.3 V | 70 ns | FLASH | 8 | TOP | YES | YES | YES | 1,2,1,31 | 1000000 | 1.0486 M | PARALLEL | YES | 5 µA | 30 µA | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 70 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA48,6X8,32 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||||
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AM29LV160BT-70RWCD
Cypress Semiconductor
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Check for Price | Yes | Transferred | 16.7772 Mbit | 16 | 16K,8K,32K,64K | 1MX16 | 3.3 V | 70 ns | FLASH | 8 | TOP | YES | YES | YES | 1,2,1,31 | 1000000 | 1.0486 M | PARALLEL | YES | 5 µA | 30 µA | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 70 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | CYPRESS SEMICONDUCTOR CORP | compliant | EAR99 | 8542.32.00.51 | |||||||||||||||||||||
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AM29LV160BT-70RWCD
Spansion
|
Check for Price | Yes | Yes | Obsolete | 16.7772 Mbit | 16 | 16K,8K,32K,64K | 1MX16 | 3.3 V | 3.3 V | 70 ns | FLASH | TOP BOOT BLOCK | 8 | TOP | YES | YES | YES | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 70 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 8 mm | SPANSION INC | BGA | 8 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 | 48 | compliant |