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AM29DS322GB120WMIN
AMD
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Check for Price | No | Transferred | 33.5544 Mbit | 16 | 8K,64K | 2MX16 | 2 V | 120 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 1 | 8,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 5 µA | 25 µA | 2.2 V | 1.8 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 6 mm | ADVANCED MICRO DEVICES INC | BGA | 6 X 12 MM, 0.80 MM PITCH, FBGA-48 | 48 | unknown | EAR99 | 8542.32.00.51 | |||||
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AM29DS322GB120WMI
Spansion
|
Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 8K,64K | 2MX16 | 2 V | 120 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 1 | 8,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 5 µA | 25 µA | 2.2 V | 1.8 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 6 mm | SPANSION INC | BGA | 6 X 12 MM, 0.80 MM PITCH, FBGA-48 | 48 | not_compliant | EAR99 | 8542.32.00.51 | |||
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AM29DS322GB120WMIN
Spansion
|
Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 8K,64K | 2MX16 | 2 V | 120 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 1 | 8,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 5 µA | 25 µA | 2.2 V | 1.8 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 6 mm | SPANSION INC | BGA | 6 X 12 MM, 0.80 MM PITCH, FBGA-48 | 48 | not_compliant | EAR99 | 8542.32.00.51 | |||
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AM29DS322GB120WMI
AMD
|
Check for Price | No | Transferred | 33.5544 Mbit | 16 | 8K,64K | 2MX16 | 2 V | 120 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 1 | 8,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 5 µA | 25 µA | 2.2 V | 1.8 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 6 mm | ADVANCED MICRO DEVICES INC | BGA | 6 X 12 MM, 0.80 MM PITCH, FBGA-48 | 48 | unknown | EAR99 | 8542.32.00.51 | |||||
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AM29DS322GB120WMI
Cypress Semiconductor
|
Check for Price | No | Active | 33.5544 Mbit | 8K,64K | 2MX16 | 1.8/2.2 V | 120 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 8,63 | 2000000 | 2.0972 M | PARALLEL | YES | 5 µA | 25 µA | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | CYPRESS SEMICONDUCTOR CORP | compliant | |||||||||||||||||||||
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AM29DS322GB120WMIN
Cypress Semiconductor
|
Check for Price | No | Active | 33.5544 Mbit | 8K,64K | 2MX16 | 1.8/2.2 V | 120 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 8,63 | 2000000 | 2.0972 M | PARALLEL | YES | 5 µA | 25 µA | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | CYPRESS SEMICONDUCTOR CORP | compliant |