Findchips: Parametric Search Results for am29dl323gb

Parametric results for: am29dl323gb under Flash Memories

Select parts from the table below to compare.

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Select Parts		Part Number

		AM29DL323GB70WDF AMD
		AM29DL323GB12PCI Spansion
		AM29DL323GB70EI AMD
		AM29DL323GB120WMF Spansion
		AM29DL323GB60EI Spansion
		AM29DL323GB90EF Spansion
		AM29DL323GB90FE Spansion
		AM29DL323GB120WDIN Spansion
		AM29DL323GB70RPCF Spansion
		AM29DL323GB70FIN Spansion

				Most Relevant						Technical																							Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Reverse Pinout	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Yes

Transferred

33.5544 Mbit

8K,64K

2MX16

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

PARALLEL

YES

5 µA

45 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

120 ns

FLASH

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

11 X 13 MM, 1 MM PITCH, FORTIFIED, BGA-64

unknown

EAR99

8542.32.00.51

BGA

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

ADVANCED MICRO DEVICES INC

TSOP1, TSSOP48,.8,20

unknown

EAR99

8542.32.00.51

TSOP1

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

TFBGA, BGA48,6X8,32

compliant

EAR99

8542.32.00.51

BGA

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

60 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP-48

not_compliant

EAR99

8542.32.00.51

TSOP

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

90 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSSOP, TSSOP48,.8,20

compliant

EAR99

8542.32.00.51

TSOP1

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

90 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

MILITARY

YES

NOR TYPE

R-PDSO-G48

Not Qualified

125 °C

-55 °C

260

PLASTIC/EPOXY

TSOP1-R

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

REVERSE, TSOP-48

not_compliant

3A001.A.2.C

8542.32.00.51

TSOP

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

SPANSION INC

8 X 14 MM, 0.80 MM PITCH, FBGA-63

not_compliant

EAR99

8542.32.00.51

BGA

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

LBGA,

compliant

EAR99

8542.32.00.51

BGA

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1-R

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

REVERSE, TSOP-48

not_compliant

EAR99

8542.32.00.51

TSOP

1 2 3 4 5 Next

Compare

AM29DL323GB70WDF

AMD

Check for Price

Yes

Transferred

33.5544 Mbit

8K,64K

2MX16

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

PARALLEL

YES

5 µA

45 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

AM29DL323GB12PCI

Spansion

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

120 ns

FLASH

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

11 X 13 MM, 1 MM PITCH, FORTIFIED, BGA-64

unknown

EAR99

8542.32.00.51

BGA

AM29DL323GB70EI

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

ADVANCED MICRO DEVICES INC

TSOP1, TSSOP48,.8,20

unknown

EAR99

8542.32.00.51

TSOP1

AM29DL323GB120WMF

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

TFBGA, BGA48,6X8,32

compliant

EAR99

8542.32.00.51

BGA

AM29DL323GB60EI

Spansion

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

60 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP-48

not_compliant

EAR99

8542.32.00.51

TSOP

AM29DL323GB90EF

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

90 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSSOP, TSSOP48,.8,20

compliant

EAR99

8542.32.00.51

TSOP1

AM29DL323GB90FE

Spansion

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

90 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

MILITARY

YES

NOR TYPE

R-PDSO-G48

Not Qualified

125 °C

-55 °C

260

PLASTIC/EPOXY

TSOP1-R

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

REVERSE, TSOP-48

not_compliant

3A001.A.2.C

8542.32.00.51

TSOP

AM29DL323GB120WDIN

Spansion

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

SPANSION INC

8 X 14 MM, 0.80 MM PITCH, FBGA-63

not_compliant

EAR99

8542.32.00.51

BGA

AM29DL323GB70RPCF

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

LBGA,

compliant

EAR99

8542.32.00.51

BGA

AM29DL323GB70FIN

Spansion

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1-R

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

REVERSE, TSOP-48

not_compliant

EAR99

8542.32.00.51

TSOP

1 2 3 4 5 Next