Findchips: Parametric Search Results for am29dl323db70r

Parametric results for: am29dl323db70r under Flash Memories

Select parts from the table below to compare.

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Select Parts		Part Number

		AM29DL323DB70RWDI AMD
		AM29DL323DB70RWDI Spansion
		AM29DL323DB70RWDIN Cypress Semiconductor
		AM29DL323DB70REIN Spansion
		AM29DL323DB70REI Cypress Semiconductor
		AM29DL323DB70RWDIN AMD
		AM29DL323DB70REI AMD
		AM29DL323DB70RWDIN Spansion
		AM29DL323DB70REIN AMD
		AM29DL323DB70REIN Cypress Semiconductor

			Most Relevant							Technical																								Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Power Supplies	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Data Retention Time-Min	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

MINIMUM 1000K PROGRAM/ERASE CYCLE; 20 YEAR DATA RETENTION

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

SPANSION INC

BGA

8 X 14 MM, 0.80 MM PITCH, FBGA-63

not_compliant

EAR99

8542.32.00.51

Check for Price

Active

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

PARALLEL

YES

5 µA

45 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP1

MO-142DD, TSOP-48

not_compliant

EAR99

8542.32.00.51

Check for Price

Active

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

PARALLEL

YES

5 µA

45 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

CYPRESS SEMICONDUCTOR CORP

compliant

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

MINIMUM 1000K PROGRAM/ERASE CYCLE; 20 YEAR DATA RETENTION

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

MINIMUM 1000K PROGRAM/ERASE CYCLE; 20 YEAR DATA RETENTION

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

ADVANCED MICRO DEVICES INC

TSOP1

TSOP1, TSSOP48,.8,20

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

SPANSION INC

BGA

8 X 14 MM, 0.80 MM PITCH, FBGA-63

not_compliant

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

MINIMUM 1000K PROGRAM/ERASE CYCLE; 20 YEAR DATA RETENTION

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

ADVANCED MICRO DEVICES INC

TSOP1

TSOP1, TSSOP48,.8,20

unknown

EAR99

8542.32.00.51

Check for Price

Active

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

PARALLEL

YES

5 µA

45 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

CYPRESS SEMICONDUCTOR CORP

compliant

1 2 Next

Compare

AM29DL323DB70RWDI

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

MINIMUM 1000K PROGRAM/ERASE CYCLE; 20 YEAR DATA RETENTION

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

AM29DL323DB70RWDI

Spansion

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

SPANSION INC

BGA

8 X 14 MM, 0.80 MM PITCH, FBGA-63

not_compliant

EAR99

8542.32.00.51

AM29DL323DB70RWDIN

Cypress Semiconductor

Check for Price

Active

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

PARALLEL

YES

5 µA

45 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

AM29DL323DB70REIN

Spansion

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP1

MO-142DD, TSOP-48

not_compliant

EAR99

8542.32.00.51

AM29DL323DB70REI

Cypress Semiconductor

Check for Price

Active

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

PARALLEL

YES

5 µA

45 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

CYPRESS SEMICONDUCTOR CORP

compliant

AM29DL323DB70RWDIN

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

MINIMUM 1000K PROGRAM/ERASE CYCLE; 20 YEAR DATA RETENTION

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

AM29DL323DB70REI

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

MINIMUM 1000K PROGRAM/ERASE CYCLE; 20 YEAR DATA RETENTION

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

ADVANCED MICRO DEVICES INC

TSOP1

TSOP1, TSSOP48,.8,20

unknown

EAR99

8542.32.00.51

AM29DL323DB70RWDIN

Spansion

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

SPANSION INC

BGA

8 X 14 MM, 0.80 MM PITCH, FBGA-63

not_compliant

EAR99

8542.32.00.51

AM29DL323DB70REIN

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

MINIMUM 1000K PROGRAM/ERASE CYCLE; 20 YEAR DATA RETENTION

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

ADVANCED MICRO DEVICES INC

TSOP1

TSOP1, TSSOP48,.8,20

unknown

EAR99

8542.32.00.51

AM29DL323DB70REIN

Cypress Semiconductor

Check for Price

Active

33.5544 Mbit

8K,64K

2MX16

3.3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

PARALLEL

YES

5 µA

45 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

CYPRESS SEMICONDUCTOR CORP

compliant

1 2 Next