Parametric results for: am27s185a under OTP ROMs

All Filters Access Time-Max JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Number of Functions Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Supply Voltage-Nom (Vsup) Access Time-Max (4)

30 ns 5 35 ns 14 45 ns 10 70 ns 1

Min (ns) - Max (ns)

33 hits Apply

R-CQCC-N28 5 R-GDFP-F18 4 R-GDIP-T18 5 R-PDIP-T18 3 R-XDIP-T18 4 R-XQCC-N28 2 S-CQCC-N28 5 S-PQCC-J28 2

33 hits Apply

e0 23

33 hits Apply

11.43 mm 5 11.5062 mm 2 13.97 mm 5 22.86 mm 5 22.987 mm 3

Min (mm) - Max (mm)

33 hits Apply

Manufacturer (2)

AMD 24 Rochester Electronics LLC 9

33 hits Apply

Memory Density (4)

8.192 kbit 24 131.072 kbit 1 262.144 kbit 2 524.288 kbit 3

Min (bit) - Max (bit)

33 hits Apply

OTP ROM 33

33 hits Apply

Memory Width (2)

4 24 8 6

Min - Max

33 hits Apply

1.0 30

33 hits Apply

18 16 28 14

33 hits Apply

2.048 k 30

33 hits Apply

2000.0 24 16000.0 1 32000.0 2 64000.0 3

Min - Max

33 hits Apply

ASYNCHRONOUS 30

33 hits Apply

70.0 °C 2 75.0 °C 14 125.0 °C 14

Min (°C) - Max (°C)

33 hits Apply

-55.0 °C 14 0.0 °C 16

Min (°C) - Max (°C)

33 hits Apply

Organization (4)

16KX8 1 2KX4 24 32KX8 2 64KX8 3

33 hits Apply

3-STATE 18

33 hits Apply

CERAMIC 6 CERAMIC, GLASS-SEALED 9 CERAMIC, METAL-SEALED COFIRED 10 PLASTIC/EPOXY 5

33 hits Apply

DFP 4 DIP 12 QCCJ 2 QCCN 12

33 hits Apply

DIP18,.3 9 FL18,.3 3 LCC28,.35X.55 5 LCC28,.45SQ 3

33 hits Apply

RECTANGULAR 23 SQUARE 7

33 hits Apply

CHIP CARRIER 14 FLATPACK 4 IN-LINE 12

33 hits Apply

Supply Voltage-Nom (Vsup) (1)

5 V 30

33 hits Apply