Parametric results for: am27ls10 under OTP ROMs

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Manufacturer Part Number: am27ls1
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AM27LS19/BFA
AMD
Check for Price No Obsolete 256 bit 8 32X8 5 V 70 ns OTP ROM 1 32 32 words ASYNCHRONOUS 3-STATE PARALLEL 80 µA 5.5 V 4.5 V BIPOLAR MILITARY R-GDFP-F16 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 16 CERAMIC, GLASS-SEALED DFP FL16,.3 RECTANGULAR FLATPACK YES Tin/Lead (Sn/Pb) FLAT 1.27 mm DUAL 2.159 mm 10.16 mm 6.731 mm ADVANCED MICRO DEVICES INC DFP DFP, FL16,.3 16 unknown EAR99 8542.32.00.71
AM27LS185DM
AMD
Check for Price No Obsolete 2.048 kbit 4 512X4 5 V 50 ns OTP ROM 1 512 2.048 k ASYNCHRONOUS PARALLEL 150 µA 5.25 V 4.75 V TTL MILITARY R-XDIP-T18 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class C 18 CERAMIC DIP DIP18,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL ADVANCED MICRO DEVICES INC DIP, DIP18,.3 unknown EAR99 8542.32.00.71
AM27LS191APCB
AMD
Check for Price No No Obsolete 262.144 kbit 8 32KX8 5 V 90 ns OTP ROM 1 32000 2.048 k ASYNCHRONOUS 3-STATE PARALLEL 185 µA 5.5 V 4.5 V BIPOLAR COMMERCIAL EXTENDED R-PDIP-T24 Not Qualified e0 75 °C 24 PLASTIC/EPOXY DIP DIP24,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.715 mm 32.004 mm 15.24 mm ADVANCED MICRO DEVICES INC DIP DIP, DIP24,.6 24 unknown EAR99 8542.32.00.71
AM27LS185DCTB
AMD
Check for Price No Obsolete 1.0486 Mbit 8 128KX8 5 V 30 ns OTP ROM 1 128000 2.048 k ASYNCHRONOUS PARALLEL 150 µA 5.5 V 4.5 V TTL COMMERCIAL R-XDIP-T18 e0 70 °C 18 CERAMIC DIP DIP18,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL ADVANCED MICRO DEVICES INC DIP, DIP18,.3 unknown EAR99 8542.32.00.71
AM27LS184DCB
AMD
Check for Price No Obsolete 4.096 kbit 8 512X8 45 ns OTP ROM 1 512 2.048 k ASYNCHRONOUS PARALLEL 175 µA TTL COMMERCIAL R-XDIP-T18 e0 70 °C 18 CERAMIC DIP DIP18,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL ADVANCED MICRO DEVICES INC DIP, DIP18,.3 unknown EAR99 8542.32.00.71
AM27LS18DM
AMD
Check for Price No Obsolete 4.096 kbit 8 512X8 5 V 45 ns OTP ROM 1 512 32 words ASYNCHRONOUS PARALLEL 5.5 V 4.5 V TTL MILITARY R-XDIP-T16 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class C 16 CERAMIC DIP DIP16,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL ADVANCED MICRO DEVICES INC DIP, DIP16,.3 unknown EAR99 8542.32.00.71
AM27LS19DMB
AMD
Check for Price No Obsolete 8 32X8 5 V 70 ns MEMORY CIRCUIT 32 32 words 80 µA TTL MILITARY R-XDIP-T16 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B (Modified) 16 CERAMIC DIP DIP16,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL ADVANCED MICRO DEVICES INC DIP, DIP16,.3 unknown EAR99 8542.32.00.71
AM27LS19LMB
AMD
Check for Price No Obsolete 8 32X8 5 V 70 ns MEMORY CIRCUIT 32 32 words 80 µA TTL MILITARY S-XQCC-N20 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B (Modified) 20 CERAMIC QCCN LCC20,.35SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) NO LEAD 1.27 mm QUAD ADVANCED MICRO DEVICES INC QCCN, LCC20,.35SQ unknown EAR99 8542.32.00.71
AM27LS18LMB
AMD
Check for Price No Obsolete 4.096 kbit 8 512X8 5 V 75 ns OTP ROM 1 512 32 words ASYNCHRONOUS PARALLEL 5.5 V 4.5 V TTL MILITARY S-XQCC-N20 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B (Modified) 20 CERAMIC QCCN LCC20,.35SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) NO LEAD 1.27 mm QUAD ADVANCED MICRO DEVICES INC QCCN, LCC20,.35SQ unknown EAR99 8542.32.00.71
AM27LS19FCB
AMD
Check for Price No Obsolete 256 bit 8 32X8 5 V 55 ns OTP ROM 1 32 32 words ASYNCHRONOUS 3-STATE PARALLEL 80 µA 5.25 V 4.75 V BIPOLAR COMMERCIAL EXTENDED R-GDFP-F16 Not Qualified e0 75 °C 16 CERAMIC, GLASS-SEALED DFP FL16,.3 RECTANGULAR FLATPACK YES Tin/Lead (Sn/Pb) FLAT 1.27 mm DUAL 2.159 mm 10.16 mm 6.731 mm ADVANCED MICRO DEVICES INC DFP DFP, FL16,.3 16 unknown EAR99 8542.32.00.71