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Parametric results for: ZL50416 under Network Interfaces

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Manufacturer Part Number: zl50416
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ZL50416GKG
 Microsemi Corporation 		Check for Price No No Obsolete 2.5 V LAN SWITCHING CIRCUIT 1 INDUSTRIAL S-PBGA-B553 e0 Not Qualified 85 °C -40 °C 553 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 37.5 mm 37.5 mm 2.46 mm MICROSEMI CORP BGA BGA, 553 compliant 8542.39.00.01
ZL50416GKG
 Zarlink Semiconductor Inc 		Check for Price No Transferred 2.5 V LAN SWITCHING CIRCUIT 1 INDUSTRIAL S-PBGA-B553 e0 Not Qualified 1 85 °C -40 °C 553 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 37.5 mm 37.5 mm 2.46 mm ZARLINK SEMICONDUCTOR INC BGA, compliant 8542.39.00.01
ZL50416/GKC
 Microsemi Corporation 		Check for Price No No Transferred 2.5 V LAN SWITCHING CIRCUIT 1 1.45 mA INDUSTRIAL S-PBGA-B553 e0 Not Qualified 85 °C -40 °C 225 553 PLASTIC/EPOXY HBGA BGA553,29X29,50 SQUARE GRID ARRAY, HEAT SINK/SLUG YES TIN LEAD BALL 1.27 mm BOTTOM 37.5 mm 37.5 mm 2.46 mm ZARLINK SEMICONDUCTOR INC BGA HBGA, BGA553,29X29,50 553 compliant 8542.39.00.01
ZL50416GKG2
 Conexant Systems Inc 		Check for Price Obsolete 2.5 V LAN SWITCHING CIRCUIT 1 INDUSTRIAL S-PBGA-B553 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 553 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG YES BALL 1.27 mm BOTTOM 37.5 mm 37.5 mm 2.46 mm CONEXANT SYSTEMS BGA HBGA, 553 compliant 8542.39.00.01
ZL50416/GKC
 Zarlink Semiconductor Inc 		Check for Price No Transferred 2.5 V LAN SWITCHING CIRCUIT 1 1.45 mA INDUSTRIAL S-PBGA-B553 e0 Not Qualified 85 °C -40 °C 225 553 PLASTIC/EPOXY HBGA BGA553,29X29,50 SQUARE GRID ARRAY, HEAT SINK/SLUG YES TIN LEAD BALL 1.27 mm BOTTOM 37.5 mm 37.5 mm 2.46 mm ZARLINK SEMICONDUCTOR INC HBGA, BGA553,29X29,50 compliant 8542.39.00.01
ZL50416GKG2
 Zarlink Semiconductor Inc 		Check for Price Yes Transferred 2.5 V LAN SWITCHING CIRCUIT 1 INDUSTRIAL S-PBGA-B553 e1 Not Qualified 85 °C -40 °C 553 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 37.5 mm 37.5 mm 2.46 mm ZARLINK SEMICONDUCTOR INC HBGA, compliant 8542.39.00.01
ZL50416/GKC
 Conexant Systems Inc 		Check for Price No Obsolete 2.5 V LAN SWITCHING CIRCUIT 1 1.45 mA INDUSTRIAL S-PBGA-B553 e0 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 553 PLASTIC/EPOXY HBGA BGA553,29X29,50 SQUARE GRID ARRAY, HEAT SINK/SLUG YES BALL 1.27 mm BOTTOM 37.5 mm 37.5 mm 2.46 mm CONEXANT SYSTEMS BGA HBGA, BGA553,29X29,50 553 compliant 8542.39.00.01
ZL50416GKG2
 Microsemi Corporation 		Check for Price Yes Yes Transferred 2.5 V LAN SWITCHING CIRCUIT 1 INDUSTRIAL S-PBGA-B553 e1 Not Qualified 85 °C -40 °C 553 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 37.5 mm 37.5 mm 2.46 mm ZARLINK SEMICONDUCTOR INC BGA HBGA, 553 compliant 8542.39.00.01