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Parametric » Telecommunication Circuits » Network Interfaces

Parametric results for: ZL50409GDC under Network Interfaces

Select parts from the table below to compare.

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Select Parts		Part Number

		ZL50409GDC Microsemi Corporation
		ZL50409GDC Zarlink Semiconductor Inc
		ZL50409GDC Conexant Systems Inc

				Most Relevant	Technical			Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Telecom IC Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

Check for Price

No

No

Transferred

1.8 V

LAN SWITCHING CIRCUIT

1

INDUSTRIAL

S-PBGA-B208

e0

Not Qualified

85 °C

-40 °C

225

208

PLASTIC/EPOXY

LBGA

BGA208,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

17 mm

17 mm

1.4 mm

ZARLINK SEMICONDUCTOR INC

BGA

LBGA, BGA208,16X16,40

208

compliant

8542.39.00.01

Check for Price

No

Transferred

1.8 V

LAN SWITCHING CIRCUIT

1

INDUSTRIAL

S-PBGA-B208

e0

Not Qualified

85 °C

-40 °C

225

208

PLASTIC/EPOXY

LBGA

BGA208,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

17 mm

17 mm

1.4 mm

ZARLINK SEMICONDUCTOR INC

LBGA, BGA208,16X16,40

compliant

8542.39.00.01

Check for Price

No

Obsolete

1.8 V

LAN SWITCHING CIRCUIT

1

INDUSTRIAL

S-PBGA-B208

e0

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

NOT SPECIFIED

208

PLASTIC/EPOXY

LBGA

BGA208,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

17 mm

17 mm

1.4 mm

CONEXANT SYSTEMS

BGA

LBGA, BGA208,16X16,40

208

compliant

8542.39.00.01

Compare

Telecommunication Circuits

Microsemi Corporation

Check for Price

No

No

Transferred

1.8 V

LAN SWITCHING CIRCUIT

1

INDUSTRIAL

S-PBGA-B208

e0

Not Qualified

85 °C

-40 °C

225

208

PLASTIC/EPOXY

LBGA

BGA208,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

17 mm

17 mm

1.4 mm

ZARLINK SEMICONDUCTOR INC

BGA

LBGA, BGA208,16X16,40

208

compliant

8542.39.00.01

Zarlink Semiconductor Inc

Check for Price

No

Transferred

1.8 V

LAN SWITCHING CIRCUIT

1

INDUSTRIAL

S-PBGA-B208

e0

Not Qualified

85 °C

-40 °C

225

208

PLASTIC/EPOXY

LBGA

BGA208,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

17 mm

17 mm

1.4 mm

ZARLINK SEMICONDUCTOR INC

LBGA, BGA208,16X16,40

compliant

8542.39.00.01

Telecommunication Circuits

Conexant Systems Inc

Check for Price

No

Obsolete

1.8 V

LAN SWITCHING CIRCUIT

1

INDUSTRIAL

S-PBGA-B208

e0

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

NOT SPECIFIED

208

PLASTIC/EPOXY

LBGA

BGA208,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

17 mm

17 mm

1.4 mm

CONEXANT SYSTEMS

BGA

LBGA, BGA208,16X16,40

208

compliant

8542.39.00.01