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Parametric results for: ZL50235 under Digital Transmission Interfaces

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Manufacturer Part Number: zl50235
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ZL50235QCG1
 Microchip Technology Inc 		$96.8179 Yes Active 1.8 V CMOS ISDN ECHO CANCELLER 1 INDUSTRIAL S-PQFP-G100 e3 Not Qualified 85 °C -40 °C 100 PLASTIC/EPOXY LFQFP QFP100,.63SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm MICROCHIP TECHNOLOGY INC 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BED, LQFP-100 compliant Microchip
ZL50235/QCC
 Microsemi Corporation 		Check for Price No No Transferred CMOS INDUSTRIAL S-PQFP-G100 Not Qualified 85 °C -40 °C 100 PLASTIC/EPOXY QFP QFP100,.63SQ,20 SQUARE FLATPACK YES GULL WING 500 µm QUAD MICROSEMI CORP unknown QFP 100 8542.39.00.01
ZL50235QCC1
 Zarlink Semiconductor Inc 		Check for Price Yes Obsolete 1.8 V ISDN ECHO CANCELLER 1 INDUSTRIAL S-PQFP-G100 e3 Not Qualified 85 °C -40 °C 260 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm ZARLINK SEMICONDUCTOR INC LFQFP, compliant 8542.39.00.01
ZL50235/GDC
 Zarlink Semiconductor Inc 		Check for Price No Transferred 1.8 V CMOS ISDN ECHO CANCELLER 1 INDUSTRIAL S-PBGA-B208 e0 Not Qualified 3 85 °C -40 °C 225 208 PLASTIC/EPOXY LBGA BGA208,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 17 mm 17 mm 1.5 mm ZARLINK SEMICONDUCTOR INC 17 X 17 MM, 1.30 MM HEIGHT, MO-192, LBGA-208 compliant 8542.39.00.01
ZL50235/QCC
 Zarlink Semiconductor Inc 		Check for Price No Obsolete 1.8 V CMOS ISDN ECHO CANCELLER 1 INDUSTRIAL S-PQFP-G100 e0 Not Qualified 3 85 °C -40 °C 260 100 PLASTIC/EPOXY LFQFP QFP100,.63SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm ZARLINK SEMICONDUCTOR INC LFQFP, QFP100,.63SQ,20 compliant 8542.39.00.01
ZL50235QCG1
 Microsemi Corporation 		Check for Price Yes Yes Transferred 1.8 V CMOS ISDN ECHO CANCELLER 1 INDUSTRIAL S-PQFP-G100 e3 Not Qualified 85 °C -40 °C 100 PLASTIC/EPOXY LFQFP QFP100,.63SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm MICROSEMI CORP 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BED, LQFP-100 compliant Microsemi Corporation QFP 100 8542.39.00.01
ZL50235QCG1
 Zarlink Semiconductor Inc 		Check for Price Yes Transferred 1.8 V ISDN ECHO CANCELLER 1 INDUSTRIAL S-PQFP-G100 e3 Not Qualified 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm ZARLINK SEMICONDUCTOR INC 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BED, LQFP-100 compliant 8542.39.00.01
ZL50235QCC1
 Microsemi Corporation 		Check for Price Yes Yes Obsolete 1.8 V ISDN ECHO CANCELLER 1 INDUSTRIAL S-PQFP-G100 e3 Not Qualified 85 °C -40 °C 260 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm ZARLINK SEMICONDUCTOR INC LFQFP, compliant QFP 100 8542.39.00.01
ZL50235/GDC
 Microsemi Corporation 		Check for Price No No Obsolete 1.8 V CMOS ISDN ECHO CANCELLER 1 INDUSTRIAL S-PBGA-B208 e0 Not Qualified 85 °C -40 °C 208 PLASTIC/EPOXY LBGA BGA208,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 17 mm 17 mm 1.5 mm MICROSEMI CORP 17 X 17 MM, 1.30 MM HEIGHT, MO-192, LBGA-208 unknown Microsemi Corporation BGA 208 8542.39.00.01