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Parametric » Telecommunication Circuits » Digital Transmission Interfaces

Parametric results for: ZL50211GBG2 under Digital Transmission Interfaces

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Select Parts		Part Number

		ZL50211GBG2 Zarlink Semiconductor Inc
		ZL50211GBG2 Microsemi Corporation
		ZL50211GBG2 Microchip Technology Inc

				Most Relevant	Technical			Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Telecom IC Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Part Package Code	Pin Count

Check for Price

Yes

Transferred

1.8 V

ISDN ECHO CANCELLER

1

INDUSTRIAL

S-PBGA-B535

e1

Not Qualified

85 °C

-40 °C

535

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

31 mm

31 mm

2.36 mm

ZARLINK SEMICONDUCTOR INC

31 X 31 MM, PLASTIC, LEAD FREE, MS-034, BGA-535

compliant

8542.39.00.01

Check for Price

Yes

Yes

Transferred

1.8 V

ISDN ECHO CANCELLER

1

INDUSTRIAL

S-PBGA-B535

e1

Not Qualified

85 °C

-40 °C

535

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

31 mm

31 mm

2.36 mm

MICROSEMI CORP

31 X 31 MM, PLASTIC, LEAD FREE, MS-034, BGA-535

compliant

8542.39.00.01

BGA

535

Check for Price

Yes

End Of Life

1.8 V

ISDN ECHO CANCELLER

1

INDUSTRIAL

S-PBGA-B535

e1

Not Qualified

85 °C

-40 °C

535

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

31 mm

31 mm

2.36 mm

MICROCHIP TECHNOLOGY INC

31 X 31 MM, PLASTIC, LEAD FREE, MS-034, BGA-535

compliant

Compare

Zarlink Semiconductor Inc

Check for Price

Yes

Transferred

1.8 V

ISDN ECHO CANCELLER

1

INDUSTRIAL

S-PBGA-B535

e1

Not Qualified

85 °C

-40 °C

535

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

31 mm

31 mm

2.36 mm

ZARLINK SEMICONDUCTOR INC

31 X 31 MM, PLASTIC, LEAD FREE, MS-034, BGA-535

compliant

8542.39.00.01

Telecommunication Circuits

Microsemi Corporation

Check for Price

Yes

Yes

Transferred

1.8 V

ISDN ECHO CANCELLER

1

INDUSTRIAL

S-PBGA-B535

e1

Not Qualified

85 °C

-40 °C

535

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

31 mm

31 mm

2.36 mm

MICROSEMI CORP

31 X 31 MM, PLASTIC, LEAD FREE, MS-034, BGA-535

compliant

8542.39.00.01

BGA

535

Microchip Technology Inc

Check for Price

Yes

End Of Life

1.8 V

ISDN ECHO CANCELLER

1

INDUSTRIAL

S-PBGA-B535

e1

Not Qualified

85 °C

-40 °C

535

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

31 mm

31 mm

2.36 mm

MICROCHIP TECHNOLOGY INC

31 X 31 MM, PLASTIC, LEAD FREE, MS-034, BGA-535

compliant