Parametric results for: ZL50016 under Telecom Switching Circuits
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ZL50016GAG2
Microsemi Corporation
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$41.9999 | Yes | Transferred | 1.8 V | DIGITAL TIME SWITCH | 1 | INDUSTRIAL | S-PBGA-B256 | e1 | Not Qualified | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | MICROSEMI CORP | 17 X 17 MM, 1.61 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, BGA-256 | compliant | 8542.39.00.01 | Microsemi Corporation | |||||||
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ZL50016GAG2
Microchip Technology Inc
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$54.1271 | Yes | Active | 1.8 V | DIGITAL TIME SWITCH | 1 | INDUSTRIAL | S-PBGA-B256 | e1 | Not Qualified | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | MICROCHIP TECHNOLOGY INC | 17 X 17 MM, 1.61 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, BGA-256 | compliant | |||||||||
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ZL50016QCC
Microsemi Corporation
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Check for Price | No | No | Transferred | 1.8 V | DIGITAL TIME SWITCH | 1 | INDUSTRIAL | S-PQFP-G256 | e0 | Not Qualified | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | LFQFP | QFP256,1.2SQ,16 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 400 µm | QUAD | 28 mm | 28 mm | 1.6 mm | MICROSEMI CORP | 28 X 28 MM, 1.40 MM HEIGHT, MS-026BJC, LQFP-256 | unknown | 8542.39.00.01 | QFP | 256 | |||||
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ZL50016GAG2
Zarlink Semiconductor Inc
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Check for Price | Yes | Transferred | 1.8 V | DIGITAL TIME SWITCH | 1 | INDUSTRIAL | S-PBGA-B256 | e1 | Not Qualified | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | ZARLINK SEMICONDUCTOR INC | 17 X 17 MM, 1.61 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, BGA-256 | unknown | 8542.39.00.01 | ||||||||
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ZL50016GAC
Zarlink Semiconductor Inc
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Check for Price | No | Transferred | 1.8 V | DIGITAL TIME SWITCH | 1 | INDUSTRIAL | S-PBGA-B256 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 225 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | ZARLINK SEMICONDUCTOR INC | 17 X 17 MM, 1.61 MM HEIGHT, PLASTIC, MS-034, BGA-256 | compliant | 8542.39.00.01 | ||||||
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ZL50016QCC
Zarlink Semiconductor Inc
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Check for Price | No | Transferred | 1.8 V | DIGITAL TIME SWITCH | 1 | INDUSTRIAL | S-PQFP-G256 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 256 | PLASTIC/EPOXY | LFQFP | QFP256,1.2SQ,16 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 400 µm | QUAD | 28 mm | 28 mm | 1.6 mm | ZARLINK SEMICONDUCTOR INC | LFQFP, QFP256,1.2SQ,16 | compliant | 8542.39.00.01 | ||||||
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ZL50016GAC
Microsemi Corporation
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Check for Price | No | No | Obsolete | 1.8 V | DIGITAL TIME SWITCH | 1 | INDUSTRIAL | S-PBGA-B256 | e0 | Not Qualified | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | MICROSEMI CORP | 17 X 17 MM, 1.61 MM HEIGHT, PLASTIC, MS-034, BGA-256 | unknown | 8542.39.00.01 | BGA | 256 |