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Parametric » Telecommunication Circuits » Codecs

Parametric results for: ZL38004GGG2 under Codecs

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Select Parts		Part Number

		ZL38004GGG2 Microchip Technology Inc
		ZL38004GGG2 Zarlink Semiconductor Inc
		ZL38004GGG2 Microsemi Corporation

			Most Relevant		Technical				Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Operating Mode	Telecom IC Type	Filter	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Part Package Code	Pin Count

Yes

Active

1.2 V

SYNCHRONOUS

ADPCM CODEC

YES

1

INDUSTRIAL

S-PBGA-B96

e3

Not Qualified

85 °C

-40 °C

96

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

MATTE TIN

BALL

500 µm

BOTTOM

7 mm

7 mm

1.01 mm

MICROCHIP TECHNOLOGY INC

VFBGA-96

compliant

Check for Price

Transferred

1.2 V

SYNCHRONOUS

ADPCM CODEC

YES

1

INDUSTRIAL

S-PBGA-B96

e3

Not Qualified

85 °C

-40 °C

96

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

MATTE TIN

BALL

500 µm

BOTTOM

7 mm

7 mm

1.01 mm

ZARLINK SEMICONDUCTOR INC

7 X 7 MM, 0.91 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VFBGA-96

unknown

8542.39.00.01

Check for Price

Yes

Transferred

1.2 V

SYNCHRONOUS

ADPCM CODEC

YES

1

INDUSTRIAL

S-PBGA-B96

e3

Not Qualified

85 °C

-40 °C

96

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

MATTE TIN

BALL

500 µm

BOTTOM

7 mm

7 mm

1.01 mm

MICROSEMI CORP

VFBGA-96

compliant

8542.39.00.01

BGA

96

Compare

Microchip Technology Inc

Yes

Active

1.2 V

SYNCHRONOUS

ADPCM CODEC

YES

1

INDUSTRIAL

S-PBGA-B96

e3

Not Qualified

85 °C

-40 °C

96

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

MATTE TIN

BALL

500 µm

BOTTOM

7 mm

7 mm

1.01 mm

MICROCHIP TECHNOLOGY INC

VFBGA-96

compliant

Zarlink Semiconductor Inc

Check for Price

Transferred

1.2 V

SYNCHRONOUS

ADPCM CODEC

YES

1

INDUSTRIAL

S-PBGA-B96

e3

Not Qualified

85 °C

-40 °C

96

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

MATTE TIN

BALL

500 µm

BOTTOM

7 mm

7 mm

1.01 mm

ZARLINK SEMICONDUCTOR INC

7 X 7 MM, 0.91 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VFBGA-96

unknown

8542.39.00.01

Telecommunication Circuits

Microsemi Corporation

Check for Price

Yes

Transferred

1.2 V

SYNCHRONOUS

ADPCM CODEC

YES

1

INDUSTRIAL

S-PBGA-B96

e3

Not Qualified

85 °C

-40 °C

96

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

MATTE TIN

BALL

500 µm

BOTTOM

7 mm

7 mm

1.01 mm

MICROSEMI CORP

VFBGA-96

compliant

8542.39.00.01

BGA

96