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ZL30105QDG1
Microchip Technology Inc
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ZL30105QDG1
Zarlink Semiconductor Inc
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ZL30105QDG1
Microsemi Corporation
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| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Supply Voltage-Nom | Technology |
Telecom IC Type
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Number of Functions |
Supply Current-Max
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Temperature Grade
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JESD-30 Code
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JESD-609 Code
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Qualification Status
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Width
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Length
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Seated Height-Max
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Ihs Manufacturer
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Reach Compliance Code
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HTS Code
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Package Description
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Part Package Code
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Pin Count
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Samacsys Manufacturer
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| Yes | Active | 1.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQFP-G64 | e3 | 3 | 85 °C | -40 °C | 260 | 64 | PLASTIC/EPOXY | TFQFP | PQFP64,.40SQ,20 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1.2 mm | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | |||||||||
| Yes | Transferred | 1.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQFP-G64 | Not Qualified | 85 °C | -40 °C | 260 | 64 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1.2 mm | ZARLINK SEMICONDUCTOR INC | compliant | 8542.39.00.01 | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64 | |||||||||||
| Yes | Yes | Transferred | 1.8 V | CMOS | TELECOM CIRCUIT | 1 | 78 mA | INDUSTRIAL | S-PQFP-G64 | e3 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | TFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1.2 mm | MICROSEMI CORP | compliant | 8542.39.00.01 | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64 | QFP | 64 | Microsemi Corporation |
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ZL30105QDG1
Microchip Technology Inc
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$77.1500 | Yes | Active | 1.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQFP-G64 | e3 | 3 | 85 °C | -40 °C | 260 | 64 | PLASTIC/EPOXY | TFQFP | PQFP64,.40SQ,20 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1.2 mm | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | ||||||||||
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ZL30105QDG1
Zarlink Semiconductor Inc
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Check for Price | Yes | Transferred | 1.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQFP-G64 | Not Qualified | 85 °C | -40 °C | 260 | 64 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1.2 mm | ZARLINK SEMICONDUCTOR INC | compliant | 8542.39.00.01 | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64 | ||||||||||||
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ZL30105QDG1
Microsemi Corporation
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Check for Price | Yes | Yes | Transferred | 1.8 V | CMOS | TELECOM CIRCUIT | 1 | 78 mA | INDUSTRIAL | S-PQFP-G64 | e3 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | TFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1.2 mm | MICROSEMI CORP | compliant | 8542.39.00.01 | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64 | QFP | 64 | Microsemi Corporation |