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1 - 8 of 8 results
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ZL10038/LDF
Intel Corporation
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Check for Price | Obsolete | HVQCCN | CONSUMER CIRCUIT | 1 | 5.25 V | 4.75 V | OTHER | S-XQCC-N40 | Not Qualified | 85 °C | -10 °C | 40 | UNSPECIFIED | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 6 mm | 6 mm | 900 µm | INTEL CORP | QFN | HVQCCN, | 40 | unknown | 8542.39.00.01 | |||||||||||
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ZL10038LDF1
Intel Corporation
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Check for Price | Yes | Obsolete | HVQCCN | CONSUMER CIRCUIT | 1 | 1.89 V | 1.71 V | COMMERCIAL | S-XQCC-N40 | Not Qualified | e3 | 70 °C | 260 | NOT SPECIFIED | 40 | PLASTIC/EPOXY | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | NO LEAD | 400 µm | QUAD | 7 mm | 7 mm | 1.6 mm | INTEL CORP | QFP | HVQCCN, | 64 | unknown | 8542.39.00.01 | |||||||
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ZL10038/LDF1
Microsemi Corporation
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Check for Price | Yes | Yes | Transferred | HVQCCN | CONSUMER CIRCUIT | 1 | 5.25 V | 4.75 V | OTHER | S-XQCC-N40 | Not Qualified | e3 | 85 °C | -10 °C | 260 | 30 | 40 | UNSPECIFIED | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 6 mm | 6 mm | 900 µm | ZARLINK SEMICONDUCTOR INC | QFN | HVQCCN, | 40 | compliant | ||||||
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ZL10038LDF1
Zarlink Semiconductor Inc
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Check for Price | Yes | Transferred | HVQCCN | CONSUMER CIRCUIT | 1 | 1.89 V | 1.71 V | COMMERCIAL | S-XQCC-N40 | Not Qualified | e3 | 70 °C | 260 | 40 | PLASTIC/EPOXY | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | NO LEAD | 400 µm | QUAD | 7 mm | 7 mm | 1.6 mm | ZARLINK SEMICONDUCTOR INC | HVQCCN, | compliant | 8542.39.00.01 | ||||||||||
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ZL10038/LDF1
Intel Corporation
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Check for Price | Yes | Active | HVQCCN | CONSUMER CIRCUIT | 1 | 5.25 V | 4.75 V | OTHER | S-XQCC-N40 | Not Qualified | e3 | 85 °C | -10 °C | 260 | NOT SPECIFIED | 40 | UNSPECIFIED | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 6 mm | 6 mm | 900 µm | INTEL CORP | QFN | HVQCCN, | 40 | unknown | |||||||
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ZL10038/LDF
Microsemi Corporation
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Check for Price | No | Transferred | QCCN | BICMOS | 322 mA | OTHER | S-PQCC-N40 | Not Qualified | 85 °C | -10 °C | 40 | PLASTIC/EPOXY | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER | YES | NO LEAD | 500 µm | QUAD | MICROSEMI CORP | QFN | 40 | unknown | 8542.39.00.01 | |||||||||||||||
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ZL10038/LDF
Zarlink Semiconductor Inc
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Check for Price | No | Transferred | HVQCCN | CONSUMER CIRCUIT | BICMOS | 1 | 322 mA | 5.25 V | 4.75 V | OTHER | S-XQCC-N40 | Not Qualified | e0 | 85 °C | -10 °C | 260 | 40 | UNSPECIFIED | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 500 µm | QUAD | 6 mm | 6 mm | 900 µm | ZARLINK SEMICONDUCTOR INC | HVQCCN, LCC40,.24SQ,20 | unknown | 8542.39.00.01 | ||||||
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ZL10038LDF1
Microsemi Corporation
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Check for Price | Yes | Yes | Transferred | HVQCCN | CONSUMER CIRCUIT | 1 | 1.89 V | 1.71 V | COMMERCIAL | S-XQCC-N40 | Not Qualified | e3 | 70 °C | 260 | 40 | PLASTIC/EPOXY | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | NO LEAD | 400 µm | QUAD | 7 mm | 7 mm | 1.6 mm | ZARLINK SEMICONDUCTOR INC | QFP | HVQCCN, | 64 | compliant | 8542.39.00.01 |