Parametric results for: XTSG468-708GGYH under Sockets and Chip Carriers

All Filters Additional Feature Contact Finish Mating Contact Finish Termination Contact Material Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Number of Contacts Part Life Cycle Code Rohs Code

UL-94V-0, BGA SOCKET 1

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GOLD OVER NICKEL 1

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GOLD OVER NICKEL 1

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Contact Material (1)

BERYLLIUM COPPER ALLOY 1

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IC SOCKET 1

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BGA468 1

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POLYPHENYLENE SULFIDE 1

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e4 1

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Manufacturer (1)

Advanced Interconnections Corp 1

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Number of Contacts (1)

468 1

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Obsolete 1

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Yes 1

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