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Parametric results for: XPC850CZT66B under Microprocessors

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Manufacturer Part Number: xpc850czt66b
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XPC850CZT66B
 Motorola Semiconductor Products 		Check for Price No Obsolete 32 66 MHz 32 26 66 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V INDUSTRIAL S-PBGA-B256 Not Qualified e0 95 °C -40 °C 256 PLASTIC/EPOXY BGA BGA256,16X16,50 SQUARE GRID ARRAY TIN LEAD BALL 1.27 mm BOTTOM 2.35 mm 23 mm 23 mm MOTOROLA INC BGA, BGA256,16X16,50 unknown 3A991.A.2 8542.31.00.01
XPC850CZT66BU
 Motorola Semiconductor Products 		Check for Price No Transferred 32 66 MHz 32 26 33 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B256 Not Qualified 256 PLASTIC/EPOXY BGA BGA256,16X16,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 2.35 mm 23 mm 23 mm MOTOROLA INC BGA, BGA256,16X16,50 unknown 3A991.A.2 8542.31.00.01
XPC850CZT66BU
 NXP Semiconductors 		Check for Price Obsolete 32 66 MHz 32 26 YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B256 256 PLASTIC/EPOXY BGA SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 2.35 mm 23 mm 23 mm NXP SEMICONDUCTORS BGA, unknown 8542.31.00.01
XPC850CZT66B
 Freescale Semiconductor 		Check for Price No Obsolete 32 66 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS 3.3 V S-PBGA-B256 Not Qualified e0 256 PLASTIC/EPOXY BGA BGA256,16X16,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM MOTOROLA SEMICONDUCTOR PRODUCTS BGA, BGA256,16X16,50 unknown
XPC850CZT66B
 Motorola Mobility LLC 		Check for Price No Obsolete 32 66 MHz 32 26 66 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V INDUSTRIAL S-PBGA-B256 Not Qualified e0 95 °C -40 °C 256 PLASTIC/EPOXY BGA BGA256,16X16,50 SQUARE GRID ARRAY TIN LEAD BALL 1.27 mm BOTTOM 2.35 mm 23 mm 23 mm MOTOROLA INC BGA, BGA256,16X16,50 unknown 3A991.A.2 8542.31.00.01 BGA 256
XPC850CZT66BU
 Freescale Semiconductor 		Check for Price No Transferred 32 66 MHz 32 26 66 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B256 Not Qualified e0 3 220 30 256 PLASTIC/EPOXY BGA BGA256,16X16,50 SQUARE GRID ARRAY TIN LEAD BALL 1.27 mm BOTTOM 2.35 mm 23 mm 23 mm FREESCALE SEMICONDUCTOR INC BGA, BGA256,16X16,50 not_compliant 5A991 8542.31.00.01 BGA 256
XPC850CZT66BU
 Motorola Mobility LLC 		Check for Price Transferred 32 66 MHz 32 26 33 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B256 Not Qualified 256 PLASTIC/EPOXY BGA BGA256,16X16,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 2.35 mm 23 mm 23 mm MOTOROLA INC BGA, BGA256,16X16,50 unknown 3A991.A.2 8542.31.00.01 BGA 256