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Parametric results for: XCZU5EV-3FBVB900E under Other uPs/uCs/Peripheral ICs

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Manufacturer Part Number: xczu5ev3fbvb900e

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Select Parts		Part Number

		XCZU5EV-3FBVB900E AMD
		XCZU5EV-3FBVB900E AMD Xilinx

			Most Relevant			Technical				Compliance		Operating Conditions				Physical								Other
Composite Price	Rohs Code	Part Life Cycle Code	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Position	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Active

YES

900 mV

MICROPROCESSOR CIRCUIT

CMOS

927 mV

873 mV

OTHER

R-PBGA-B900

100 °C

245

900

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

TIN SILVER COPPER

BALL

BOTTOM

ADVANCED MICRO DEVICES INC

FCBGA-900

compliant

Check for Price

Yes

Transferred

YES

900 mV

MICROPROCESSOR CIRCUIT

CMOS

927 mV

873 mV

OTHER

R-PBGA-B900

100 °C

245

900

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

XILINX INC

BGA, BGA900,30X30,40

compliant

5A002.A.4

8542.39.00.01

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XCZU5EV-3FBVB900E

AMD

Check for Price

Yes

Active

YES

900 mV

MICROPROCESSOR CIRCUIT

CMOS

927 mV

873 mV

OTHER

R-PBGA-B900

100 °C

245

900

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

TIN SILVER COPPER

BALL

BOTTOM

ADVANCED MICRO DEVICES INC

FCBGA-900

compliant

XCZU5EV-3FBVB900E

AMD Xilinx

Check for Price

Yes

Transferred

YES

900 mV

MICROPROCESSOR CIRCUIT

CMOS

927 mV

873 mV

OTHER

R-PBGA-B900

100 °C

245

900

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

XILINX INC

BGA, BGA900,30X30,40

compliant

5A002.A.4

8542.39.00.01