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Parametric results for: XCVP1202-1LLIVSVA2785 under Other uPs/uCs/Peripheral ICs

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Manufacturer Part Number: xcvp12021llivsva2785

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Select Parts		Part Number

		XCVP1202-1LLIVSVA2785 AMD
		XCVP1202-1LLIVSVA2785 AMD Xilinx

			Most Relevant			Technical			Compliance	Operating Conditions		Physical									Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code

Check for Price

Yes

Active

YES

700 mV

MICROPROCESSOR CIRCUIT

CMOS

724 mV

676 mV

S-PBGA-B2785

110 °C

-40 °C

2785

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

920 µm

BOTTOM

4.48 mm

50 mm

50 mm

ADVANCED MICRO DEVICES INC

FCBGA-2785

compliant

Check for Price

Yes

Transferred

YES

700 mV

SoC

CMOS

724 mV

676 mV

S-PBGA-B2785

110 °C

-40 °C

2785

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

920 µm

BOTTOM

4.48 mm

50 mm

50 mm

XILINX INC

FCBGA-2785

compliant

Compare

XCVP1202-1LLIVSVA2785

AMD

Check for Price

Yes

Active

YES

700 mV

MICROPROCESSOR CIRCUIT

CMOS

724 mV

676 mV

S-PBGA-B2785

110 °C

-40 °C

2785

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

920 µm

BOTTOM

4.48 mm

50 mm

50 mm

ADVANCED MICRO DEVICES INC

FCBGA-2785

compliant

XCVP1202-1LLIVSVA2785

AMD Xilinx

Check for Price

Yes

Transferred

YES

700 mV

SoC

CMOS

724 mV

676 mV

S-PBGA-B2785

110 °C

-40 °C

2785

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

920 µm

BOTTOM

4.48 mm

50 mm

50 mm

XILINX INC

FCBGA-2785

compliant