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Parametric results for: XCF02S under EEPROMs

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Manufacturer Part Number: xcf02s
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XCF02SVOG20C
 AMD Xilinx 		$7.4023 Yes Yes Obsolete 2.0972 Mbit 1 2MX1 3.3 V CONFIGURATION MEMORY IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL 20 20000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS SERIAL 1 mA 10 µA 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE R-PDSO-G20 Not Qualified e3 3 85 °C -40 °C 260 30 20 PLASTIC/EPOXY TSSOP TSSOP20,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 650 µm DUAL 1.19 mm 6.5024 mm 4.4 mm XILINX INC TSSOP LEAD-FREE, PLASTIC, TSSOP-20 20 compliant EAR99 8542.32.00.51
XCF02SVO20C
 AMD Xilinx 		$8.4368 No No Obsolete 2.0972 Mbit 1 2MX1 3.3 V CONFIGURATION MEMORY IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL 20 20000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS SERIAL 1 mA 10 µA 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE R-PDSO-G20 Not Qualified e0 3 85 °C -40 °C 225 30 20 PLASTIC/EPOXY TSSOP TSSOP20,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 1.19 mm 6.5024 mm 4.4 mm XILINX INC TSSOP PLASTIC, TSSOP-20 20 not_compliant EAR99 8542.32.00.51
XCF02SVO20C0901
 AMD Xilinx 		Check for Price Obsolete 2.0972 Mbit 1 2MX1 3.3 V CONFIGURATION MEMORY 1 2000000 2.0972 M SYNCHRONOUS SERIAL 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G20 Not Qualified 85 °C -40 °C 20 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 1.19 mm 6.5024 mm 4.4 mm XILINX INC TSSOP TSSOP, 20 unknown 3A991.B.1.B.1 8542.32.00.51
XCF02SVOG20C0936
 AMD Xilinx 		Check for Price Yes Yes Obsolete 2.0972 Mbit 1 2MX1 3.3 V CONFIGURATION MEMORY 1 2000000 2.0972 M SYNCHRONOUS SERIAL 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G20 Not Qualified e3 3 85 °C -40 °C 260 30 20 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 650 µm DUAL 1.19 mm 6.5024 mm 4.4 mm XILINX INC TSSOP LEAD FREE, PLASTIC, TSSOP-20 20 compliant 3A991.B.1.B.1 8542.32.00.51
XCF02SVOG20CES
 AMD Xilinx 		Check for Price Yes Yes Obsolete 2.0972 Mbit 1 2MX1 3.3 V CONFIGURATION MEMORY 1 2000000 2.0972 M SYNCHRONOUS SERIAL 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G20 Not Qualified e3 3 85 °C -40 °C 20 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.19 mm 6.5024 mm 4.4 mm XILINX INC TSSOP TSSOP, 20 compliant 3A991.B.1.B.1 8542.32.00.51
XCF02SVO20C0936
 AMD Xilinx 		Check for Price No No Obsolete 2.0972 Mbit 1 2MX1 3.3 V CONFIGURATION MEMORY 1 2000000 2.0972 M SYNCHRONOUS SERIAL 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G20 Not Qualified e0 3 85 °C -40 °C 225 30 20 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 1.19 mm 6.5024 mm 4.4 mm XILINX INC TSSOP TSSOP, 20 not_compliant 3A991.B.1.B.1 8542.32.00.51
XCF02SVOG20C0901
 AMD Xilinx 		Check for Price Obsolete 2.0972 Mbit 1 2MX1 3.3 V CONFIGURATION MEMORY 1 2000000 2.0972 M SYNCHRONOUS SERIAL 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G20 Not Qualified 85 °C -40 °C 20 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 1.19 mm 6.5024 mm 4.4 mm XILINX INC TSSOP TSSOP, 20 unknown 3A991.B.1.B.1 8542.32.00.51
XCF02SVO20CES
 AMD Xilinx 		Check for Price No No Obsolete 2.0972 Mbit 1 2MX1 3.3 V CONFIGURATION MEMORY 1 2000000 2.0972 M SYNCHRONOUS SERIAL 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G20 Not Qualified e0 3 85 °C -40 °C 20 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 1.19 mm 6.5024 mm 4.4 mm XILINX INC TSSOP TSSOP, 20 compliant 3A991.B.1.B.1 8542.32.00.51