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Parametric » Telecommunication Circuits » Other Telecom ICs

Parametric results for: X9530B15I under Other Telecom ICs

Select parts from the table below to compare.

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Select Parts		Part Number

		X9530B15I-T1 Intersil Corporation
		X9530B15I-T2 Xicor Inc
		X9530B15I-T1 Xicor Inc
		X9530B15I-T2 Intersil Corporation

			Most Relevant		Technical		Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Telecom IC Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

Check for Price

No

Obsolete

5 V

TELECOM CIRCUIT

1

INDUSTRIAL

R-PBGA-B15

e0

Not Qualified

100 °C

-40 °C

15

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

650 µm

BOTTOM

2.691 mm

3.504 mm

710 µm

INTERSIL CORP

BGA

2.70 X 3.50 MM, CSP-15

15

not_compliant

8542.39.00.01

Check for Price

No

Obsolete

5 V

TELECOM CIRCUIT

1

INDUSTRIAL

R-PBGA-B15

e0

Not Qualified

100 °C

-40 °C

15

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

650 µm

BOTTOM

2.691 mm

3.504 mm

710 µm

XICOR INC

CSP-15

unknown

Check for Price

No

Transferred

5 V

TELECOM CIRCUIT

1

INDUSTRIAL

R-PBGA-B15

e0

Not Qualified

100 °C

-40 °C

15

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

650 µm

BOTTOM

2.691 mm

3.504 mm

710 µm

XICOR INC

CSP-15

unknown

Check for Price

No

Obsolete

5 V

TELECOM CIRCUIT

1

INDUSTRIAL

R-PBGA-B15

e0

Not Qualified

100 °C

-40 °C

15

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

650 µm

BOTTOM

2.691 mm

3.504 mm

710 µm

INTERSIL CORP

BGA

2.70 X 3.50 MM, CSP-15

15

not_compliant

8542.39.00.01

Compare

Telecommunication Circuits

Intersil Corporation

Check for Price

No

Obsolete

5 V

TELECOM CIRCUIT

1

INDUSTRIAL

R-PBGA-B15

e0

Not Qualified

100 °C

-40 °C

15

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

650 µm

BOTTOM

2.691 mm

3.504 mm

710 µm

INTERSIL CORP

BGA

2.70 X 3.50 MM, CSP-15

15

not_compliant

8542.39.00.01

Xicor Inc

Check for Price

No

Obsolete

5 V

TELECOM CIRCUIT

1

INDUSTRIAL

R-PBGA-B15

e0

Not Qualified

100 °C

-40 °C

15

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

650 µm

BOTTOM

2.691 mm

3.504 mm

710 µm

XICOR INC

CSP-15

unknown

Xicor Inc

Check for Price

No

Transferred

5 V

TELECOM CIRCUIT

1

INDUSTRIAL

R-PBGA-B15

e0

Not Qualified

100 °C

-40 °C

15

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

650 µm

BOTTOM

2.691 mm

3.504 mm

710 µm

XICOR INC

CSP-15

unknown

Telecommunication Circuits

Intersil Corporation

Check for Price

No

Obsolete

5 V

TELECOM CIRCUIT

1

INDUSTRIAL

R-PBGA-B15

e0

Not Qualified

100 °C

-40 °C

15

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

650 µm

BOTTOM

2.691 mm

3.504 mm

710 µm

INTERSIL CORP

BGA

2.70 X 3.50 MM, CSP-15

15

not_compliant

8542.39.00.01