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X2864HDMB-90
Xicor Inc
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 90 ns | EEPROM | NO | YES | 5000 Write/Erase Cycles | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | 32 words | PARALLEL | 5 V | 150 µA | 5.5 V | 4.5 V | NMOS | MILITARY | NO | 5 ms | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 7.24 mm | 37.15 mm | 15.24 mm | XICOR INC | HERMETIC SEALED, CERDIP-28 | unknown | |||||||
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X2864HF-90
Xicor Inc
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 90 ns | EEPROM | NO | YES | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | 32 words | PARALLEL | 5 V | 5.25 V | 4.75 V | NMOS | COMMERCIAL | NO | 5 ms | R-CDFP-F28 | Not Qualified | e0 | 70 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DFP | FL28,.4 | RECTANGULAR | FLATPACK | YES | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | 3.3 mm | 18.288 mm | XICOR INC | CERAMIC, FP-28 | unknown | ||||||||||||
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UX2864H-250
LSI Corporation
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Check for Price | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 250 ns | EEPROM | NO | YES | 10000 Write/Erase Cycles | 8000 | 8.192 k | PARALLEL | YES | 120 µA | MOS | NO | 2 ms | Not Qualified | DIE OR CHIP | SEEQ TECHNOLOGY INC | , DIE OR CHIP | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||||||||||
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X2864HJ-90
Xicor Inc
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 90 ns | EEPROM | 32 BYTE PAGE WRITE; OVER 10 YEARS DATA RETENTION | NO | YES | 10 | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | 32 words | PARALLEL | 5 V | 5.25 V | 4.75 V | NMOS | COMMERCIAL | NO | 5 ms | R-PQCC-J32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.56 mm | 13.97 mm | 11.43 mm | XICOR INC | QCCJ, LDCC32,.5X.6 | unknown | |||||||||
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X2864HJ-70
Xicor Inc
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 70 ns | EEPROM | 32 BYTE PAGE WRITE; OVER 10 YEARS DATA RETENTION | NO | YES | 10 | 10000 Write/Erase Cycles | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | 32 words | PARALLEL | 5 V | 150 µA | 5.25 V | 4.75 V | NMOS | COMMERCIAL | NO | 5 ms | R-PQCC-J32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.56 mm | 13.97 mm | 11.43 mm | XICOR INC | QCCJ, LDCC32,.5X.6 | unknown | |||||||
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X2864HG-70
Xicor Inc
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Check for Price | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 70 ns | EEPROM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 V | 5.25 V | 4.75 V | NMOS | COMMERCIAL | R-GQCC-N32 | Not Qualified | 70 °C | 32 | CERAMIC, GLASS-SEALED | QCCN | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 13.97 mm | 11.43 mm | XICOR INC | FRIT SEALED, CERAMIC, LCC-32 | unknown | ||||||||||||||||||||
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X2864HG-90
Xicor Inc
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Check for Price | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 90 ns | EEPROM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 V | 5.25 V | 4.75 V | NMOS | COMMERCIAL | R-GQCC-N32 | Not Qualified | 70 °C | 32 | CERAMIC, GLASS-SEALED | QCCN | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 13.97 mm | 11.43 mm | XICOR INC | FRIT SEALED, CERAMIC, LCC-32 | unknown | ||||||||||||||||||||
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X2864HEMB-90
Xicor Inc
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 90 ns | EEPROM | NO | YES | 5000 Write/Erase Cycles | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | 32 words | PARALLEL | 5 V | 150 µA | 5.5 V | 4.5 V | NMOS | MILITARY | NO | 5 ms | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 13.97 mm | 11.43 mm | XICOR INC | CERAMIC, LCC-32 | unknown | |||||||
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UX2864H-200
LSI Corporation
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Check for Price | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 200 ns | EEPROM | NO | YES | 10000 Write/Erase Cycles | 8000 | 8.192 k | PARALLEL | YES | 110 µA | MOS | NO | 2 ms | Not Qualified | DIE OR CHIP | SEEQ TECHNOLOGY INC | , DIE OR CHIP | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||||||||||
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X2864HFI-90
Xicor Inc
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 90 ns | EEPROM | NO | YES | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | 32 words | PARALLEL | 5 V | 5.5 V | 4.5 V | NMOS | INDUSTRIAL | NO | 5 ms | R-CDFP-F28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DFP | FL28,.4 | RECTANGULAR | FLATPACK | YES | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | 3.3 mm | 18.288 mm | XICOR INC | CERAMIC, FP-28 | unknown |