Parametric results for: WS57C256F-55DMB under EPROMs
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WS57C256F-55DMB
STMicroelectronics
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 500 µA | 133 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 37.215 mm | 15.24 mm | STMICROELECTRONICS | DIP | 0.600 INCH, CERDIP-28 | 28 | not_compliant | 3A001.A.2.C | 8542.32.00.61 | ||
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WS57C256F-55DMB
Waferscale Integration Inc
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 500 µA | 133 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | WAFERSCALE INTEGRATION INC | 0.600 INCH, CERDIP-28 | unknown | 3A001.A.2.C | 8542.32.00.61 | |||||||
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WS57C256F-55DMB
Teledyne e2v
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Check for Price | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 30 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T28 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | TELEDYNE E2V (UK) LTD | DIP | 0.600 INCH, CERAMIC, DIP-28 | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 |