Register or Sign In
Parametric » Memory » EPROMs

Parametric results for: WS27C256L-12 under EPROMs

Filter Your Search

1 - 10 of 13 results

|
13 hits
13 hits
13 hits
13 hits
-
13 hits
13 hits
13 hits
13 hits
13 hits
13 hits
13 hits
13 hits
13 hits
13 hits
-
13 hits
-
13 hits
13 hits
13 hits
13 hits
13 hits
13 hits
13 hits
13 hits
13 hits
Manufacturer Part Number: ws27c256l12
Select parts from the table below to compare.
 Compare
Compare
WS27C256L-12DMB
 STMicroelectronics 		Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 120 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 51 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T28 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B 28 CERAMIC, GLASS-SEALED WDIP DIP28,.6 RECTANGULAR IN-LINE, WINDOW NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.72 mm 37.215 mm 15.24 mm STMICROELECTRONICS DIP 0.600 INCH, CERDIP-28 28 not_compliant 3A001.A.2.C 8542.32.00.61
WS27C256L-12LMB
 Waferscale Integration Inc 		Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 120 ns UVPROM CARD COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 51 µA CMOS MILITARY R-XQCC-J32 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 32 CERAMIC QCCJ LDCC32,.45X.7 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD WAFERSCALE INTEGRATION INC unknown 3A001.A.2.C 8542.32.00.61
WS27C256L-12TMB
 STMicroelectronics 		Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 120 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 51 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T28 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B 28 CERAMIC, GLASS-SEALED WDIP DIP28,.3 RECTANGULAR IN-LINE, WINDOW NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.08 mm 37.085 mm 7.62 mm STMICROELECTRONICS DIP 0.300 INCH, CERDIP-28 28 not_compliant 3A001.A.2.C 8542.32.00.61
WS27C256L-12CMB
 Waferscale Integration Inc 		Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 120 ns UVPROM CARD COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 51 µA 5.5 V 4.5 V CMOS MILITARY R-CQCC-N32 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B 32 CERAMIC, METAL-SEALED COFIRED QCCN LCC32,.45X.55 RECTANGULAR CHIP CARRIER YES TIN LEAD NO LEAD 1.27 mm QUAD WAFERSCALE INTEGRATION INC CERAMIC, LCC-32 unknown 3A001.A.2.C 8542.32.00.61
WS27C256L-12DMB
 Waferscale Integration Inc 		Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 120 ns UVPROM CARD COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 51 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T28 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B 28 CERAMIC, GLASS-SEALED DIP DIP28,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL WAFERSCALE INTEGRATION INC 0.600 INCH, CERDIP-28 unknown 3A001.A.2.C 8542.32.00.61
WS27C256L-12CI
 Waferscale Integration Inc 		Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 120 ns UVPROM CARD COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 51 µA CMOS INDUSTRIAL R-XQCC-N32 Not Qualified e0 85 °C -40 °C 32 CERAMIC QCCN LCC32,.45X.55 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn/Pb) NO LEAD 1.27 mm QUAD WAFERSCALE INTEGRATION INC unknown EAR99 8542.32.00.61
WS27C256L-12CMB
 STMicroelectronics 		Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 120 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 51 µA 5.5 V 4.5 V CMOS MILITARY R-CQCC-N32 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B 32 CERAMIC, METAL-SEALED COFIRED WQCCN LCC32,.45X.55 RECTANGULAR CHIP CARRIER, WINDOW YES TIN LEAD NO LEAD 1.27 mm QUAD 3.3 mm 13.97 mm 11.43 mm STMICROELECTRONICS QFJ CERAMIC, LLCC-32 32 not_compliant 3A001.A.2.C 8542.32.00.61
WS27C256L12S
 Waferscale Integration Inc 		Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 120 ns UVPROM CARD COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 100 µA 33 µA CMOS COMMERCIAL R-PDIP-T28 Not Qualified 70 °C 28 PLASTIC/EPOXY DIP DIP28,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL WAFERSCALE INTEGRATION INC unknown EAR99 8542.32.00.61
WS27C256L-12DM
 Waferscale Integration Inc 		Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 120 ns UVPROM CARD COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 51 µA CMOS MILITARY R-XDIP-T28 Not Qualified e0 125 °C -55 °C 28 CERAMIC DIP DIP28,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL WAFERSCALE INTEGRATION INC unknown 3A001.A.2.C 8542.32.00.61
WS27C256L-12TMB
 Waferscale Integration Inc 		Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 120 ns UVPROM CARD COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 51 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T28 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B 28 CERAMIC, GLASS-SEALED DIP DIP28,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL WAFERSCALE INTEGRATION INC 0.300 INCH, CERDIP-28 unknown 3A001.A.2.C 8542.32.00.61
12Next