Findchips: Parametric Search Results for WED3C755E8MF-350BC


Select Parts		Part Number

		WED3C755E8MF-350BC Microsemi Corporation
		WED3C755E8MF-350BC White Electronic Designs Corp

				Most Relevant						Technical									Compliance		Operating Conditions			Physical								Dimensions	Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

350 MHz

66 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

2.1 V

1.9 V

COMMERCIAL

R-CBGA-B255

Not Qualified

70 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.85 mm

MICROSEMI CORP

BGA

BGA,

255

compliant

3A991.A.2

8542.31.00.01

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Transferred

350 MHz

66 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

2.1 V

1.9 V

COMMERCIAL

R-CBGA-B255

Not Qualified

70 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.85 mm

WHITE ELECTRONIC DESIGNS CORP

21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

unknown

3A991.A.2

8542.31.00.01

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WED3C755E8MF-350BC

Microsemi Corporation

Check for Price

Obsolete

350 MHz

66 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

2.1 V

1.9 V

COMMERCIAL

R-CBGA-B255

Not Qualified

70 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.85 mm

MICROSEMI CORP

BGA

BGA,

255

compliant

3A991.A.2

8542.31.00.01

WED3C755E8MF-350BC

White Electronic Designs Corp

Check for Price

Transferred

350 MHz

66 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

2.1 V

1.9 V

COMMERCIAL

R-CBGA-B255

Not Qualified

70 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.85 mm

WHITE ELECTRONIC DESIGNS CORP

21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

unknown

3A991.A.2

8542.31.00.01

Parametric results for: WED3C755E8MF-350BC under Microprocessors