We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Findchips Blog
Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: WED3C7410 under Microprocessors

Filter Your Search

1 - 10 of 108 results

All Filters
|
108 hits
32643240485664
-
108 hits
32643240485664
-
108 hits
108 hits
133400133200267333400
-
108 hits
32643240485664
-
108 hits
108 hits
108 hits
100450100188275363450
-
108 hits
108 hits
108 hits
Manufacturer Part Number: wed3c7410
Select parts from the table below to compare.
 Compare
Select Parts Part Number
WED3C7410E16MC450BH9I
 White Electronic Designs Corp
WED3C7410E16M400BM
 Microsemi Corporation
WED3C7410E16MC-400BHM
 Microsemi Corporation
WED3C7410E16M-450BHM
 White Electronic Designs Corp
WED3C7410E16M-450BI
 White Electronic Designs Corp
WED3C7410E16M400BC
 White Electronic Designs Corp
WED3C7410E16M450BHM
 Microsemi Corporation
WED3C7410E16M450BHI
 Microsemi Corporation
WED3C7410E16MC450BHC
 White Electronic Designs Corp
WED3C7410E16M-450BHI
 White Electronic Designs Corp
Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
Composite Price
Pbfree Code
Rohs Code
Part Life Cycle Code
Bit Size
Speed
External Data Bus Width
Address Bus Width
Clock Frequency-Max
Surface Mount
Supply Voltage-Nom
uPs/uCs/Peripheral ICs Type
Technology
Additional Feature
Boundary Scan
Format
Integrated Cache
Low Power Mode
Power Supplies
Supply Voltage-Max
Supply Voltage-Min
Temperature Grade
JESD-30 Code
Qualification Status
JESD-609 Code
Operating Temperature-Max
Operating Temperature-Min
Peak Reflow Temperature (Cel)
Time@Peak Reflow Temperature-Max (s)
Number of Terminals
Package Body Material
Package Code
Package Equivalence Code
Package Shape
Package Style
Terminal Finish
Terminal Form
Terminal Pitch
Terminal Position
Seated Height-Max
Width
Length
Ihs Manufacturer
Package Description
Reach Compliance Code
ECCN Code
HTS Code
Part Package Code
Pin Count
Check for Price Buy
Transferred 450 MHz 64 32 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS LG-MAX;WD-MAX;SEATED HT-CALCULATED YES FLOATING POINT YES YES 1.9 V 1.7 V INDUSTRIAL R-PBGA-B255 Not Qualified 85 °C -40 °C 255 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY BALL 1.27 mm BOTTOM 3.262 mm 21.21 mm 25.25 mm WHITE ELECTRONIC DESIGNS CORP BGA-255 unknown 3A991.A.2 8542.31.00.01
Check for Price Buy
No No Obsolete 400 MHz 64 32 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES NO 1.9 V 1.7 V MILITARY R-CBGA-B225 Not Qualified 125 °C -55 °C NOT SPECIFIED NOT SPECIFIED 225 CERAMIC, METAL-SEALED COFIRED BGA RECTANGULAR GRID ARRAY BALL BOTTOM MICROSEMI CORP BGA, unknown 3A991.A.2 8542.31.00.01 BGA 225
Check for Price Buy
Active 64 400 MHz YES MICROPROCESSOR, RISC 1.8,2.5,3.3 V MILITARY S-XBGA-B255 Not Qualified 125 °C -55 °C 255 CERAMIC BGA BGA255,16X16,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM MICROSEMI CORP BGA, BGA255,16X16,50 unknown
Check for Price Buy
No Transferred 450 MHz 32 64 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.9 V 1.7 V MILITARY R-CBGA-B255 Not Qualified 125 °C -55 °C NOT SPECIFIED NOT SPECIFIED 255 CERAMIC, METAL-SEALED COFIRED BGA RECTANGULAR GRID ARRAY BALL 1.27 mm BOTTOM 2.652 mm WHITE ELECTRONIC DESIGNS CORP 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, BGA-255 unknown 3A991.A.2 8542.31.00.01
Check for Price Buy
No Transferred 450 MHz 64 32 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES NO 1.9 V 1.7 V INDUSTRIAL R-CBGA-B225 Not Qualified e0 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 225 CERAMIC, METAL-SEALED COFIRED BGA RECTANGULAR GRID ARRAY BALL 1.27 mm BOTTOM 3.14 mm WHITE ELECTRONIC DESIGNS CORP 21 X 25 MM, CERAMIC, BGA-225 unknown 3A991.A.2 8542.31.00.01
Check for Price Buy
No Transferred 64 400 MHz 64 32 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES NO 1.9 V 1.7 V COMMERCIAL R-CBGA-B225 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 225 CERAMIC, METAL-SEALED COFIRED BGA BGA255,16X16,50 RECTANGULAR GRID ARRAY BALL 1.27 mm BOTTOM 3.14 mm 21 mm 25 mm WHITE ELECTRONIC DESIGNS CORP 21 X 25 MM, CERAMIC, BGA-225 unknown 3A991.A.2 8542.31.00.01
Check for Price Buy
No Obsolete 450 MHz 64 32 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.9 V 1.7 V MILITARY R-CBGA-B255 Not Qualified e0 125 °C -55 °C 255 CERAMIC, METAL-SEALED COFIRED BGA RECTANGULAR GRID ARRAY TIN LEAD BALL BOTTOM MICROSEMI CORP 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, BGA-255 unknown 3A991.A.2 8542.31.00.01
Check for Price Buy
No Obsolete 450 MHz 32 64 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.9 V 1.7 V INDUSTRIAL R-CBGA-B255 Not Qualified e0 85 °C -40 °C 255 CERAMIC, METAL-SEALED COFIRED BGA RECTANGULAR GRID ARRAY TIN LEAD BALL BOTTOM MICROSEMI CORP 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, BGA-255 unknown 3A991.A.2 8542.31.00.01
Check for Price Buy
Transferred 450 MHz 64 32 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS LG-MAX;WD-MAX;SEATED HT-CALCULATED YES FLOATING POINT YES YES 1.9 V 1.7 V COMMERCIAL R-PBGA-B255 Not Qualified 70 °C 255 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY BALL 1.27 mm BOTTOM 3.11 mm 21.21 mm 25.25 mm WHITE ELECTRONIC DESIGNS CORP BGA-255 unknown 3A991.A.2 8542.31.00.01
Check for Price Buy
No Transferred 450 MHz 32 64 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.9 V 1.7 V INDUSTRIAL R-CBGA-B255 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 255 CERAMIC, METAL-SEALED COFIRED BGA RECTANGULAR GRID ARRAY BALL 1.27 mm BOTTOM 2.652 mm WHITE ELECTRONIC DESIGNS CORP 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, BGA-255 unknown 3A991.A.2 8542.31.00.01
12345Next
Compare
WED3C7410E16MC450BH9I
 White Electronic Designs Corp 		Check for Price Buy Transferred 450 MHz 64 32 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS LG-MAX;WD-MAX;SEATED HT-CALCULATED YES FLOATING POINT YES YES 1.9 V 1.7 V INDUSTRIAL R-PBGA-B255 Not Qualified 85 °C -40 °C 255 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY BALL 1.27 mm BOTTOM 3.262 mm 21.21 mm 25.25 mm WHITE ELECTRONIC DESIGNS CORP BGA-255 unknown 3A991.A.2 8542.31.00.01
WED3C7410E16M400BM
 Microsemi Corporation 		Check for Price Buy No No Obsolete 400 MHz 64 32 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES NO 1.9 V 1.7 V MILITARY R-CBGA-B225 Not Qualified 125 °C -55 °C NOT SPECIFIED NOT SPECIFIED 225 CERAMIC, METAL-SEALED COFIRED BGA RECTANGULAR GRID ARRAY BALL BOTTOM MICROSEMI CORP BGA, unknown 3A991.A.2 8542.31.00.01 BGA 225
WED3C7410E16MC-400BHM
 Microsemi Corporation 		Check for Price Buy Active 64 400 MHz YES MICROPROCESSOR, RISC 1.8,2.5,3.3 V MILITARY S-XBGA-B255 Not Qualified 125 °C -55 °C 255 CERAMIC BGA BGA255,16X16,50 SQUARE GRID ARRAY BALL 1.27 mm BOTTOM MICROSEMI CORP BGA, BGA255,16X16,50 unknown
WED3C7410E16M-450BHM
 White Electronic Designs Corp 		Check for Price Buy No Transferred 450 MHz 32 64 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.9 V 1.7 V MILITARY R-CBGA-B255 Not Qualified 125 °C -55 °C NOT SPECIFIED NOT SPECIFIED 255 CERAMIC, METAL-SEALED COFIRED BGA RECTANGULAR GRID ARRAY BALL 1.27 mm BOTTOM 2.652 mm WHITE ELECTRONIC DESIGNS CORP 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, BGA-255 unknown 3A991.A.2 8542.31.00.01
WED3C7410E16M-450BI
 White Electronic Designs Corp 		Check for Price Buy No Transferred 450 MHz 64 32 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES NO 1.9 V 1.7 V INDUSTRIAL R-CBGA-B225 Not Qualified e0 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 225 CERAMIC, METAL-SEALED COFIRED BGA RECTANGULAR GRID ARRAY BALL 1.27 mm BOTTOM 3.14 mm WHITE ELECTRONIC DESIGNS CORP 21 X 25 MM, CERAMIC, BGA-225 unknown 3A991.A.2 8542.31.00.01
WED3C7410E16M400BC
 White Electronic Designs Corp 		Check for Price Buy No Transferred 64 400 MHz 64 32 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES NO 1.9 V 1.7 V COMMERCIAL R-CBGA-B225 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 225 CERAMIC, METAL-SEALED COFIRED BGA BGA255,16X16,50 RECTANGULAR GRID ARRAY BALL 1.27 mm BOTTOM 3.14 mm 21 mm 25 mm WHITE ELECTRONIC DESIGNS CORP 21 X 25 MM, CERAMIC, BGA-225 unknown 3A991.A.2 8542.31.00.01
WED3C7410E16M450BHM
 Microsemi Corporation 		Check for Price Buy No Obsolete 450 MHz 64 32 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.9 V 1.7 V MILITARY R-CBGA-B255 Not Qualified e0 125 °C -55 °C 255 CERAMIC, METAL-SEALED COFIRED BGA RECTANGULAR GRID ARRAY TIN LEAD BALL BOTTOM MICROSEMI CORP 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, BGA-255 unknown 3A991.A.2 8542.31.00.01
WED3C7410E16M450BHI
 Microsemi Corporation 		Check for Price Buy No Obsolete 450 MHz 32 64 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.9 V 1.7 V INDUSTRIAL R-CBGA-B255 Not Qualified e0 85 °C -40 °C 255 CERAMIC, METAL-SEALED COFIRED BGA RECTANGULAR GRID ARRAY TIN LEAD BALL BOTTOM MICROSEMI CORP 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, BGA-255 unknown 3A991.A.2 8542.31.00.01
WED3C7410E16MC450BHC
 White Electronic Designs Corp 		Check for Price Buy Transferred 450 MHz 64 32 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS LG-MAX;WD-MAX;SEATED HT-CALCULATED YES FLOATING POINT YES YES 1.9 V 1.7 V COMMERCIAL R-PBGA-B255 Not Qualified 70 °C 255 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY BALL 1.27 mm BOTTOM 3.11 mm 21.21 mm 25.25 mm WHITE ELECTRONIC DESIGNS CORP BGA-255 unknown 3A991.A.2 8542.31.00.01
WED3C7410E16M-450BHI
 White Electronic Designs Corp 		Check for Price Buy No Transferred 450 MHz 32 64 133 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.9 V 1.7 V INDUSTRIAL R-CBGA-B255 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 255 CERAMIC, METAL-SEALED COFIRED BGA RECTANGULAR GRID ARRAY BALL 1.27 mm BOTTOM 2.652 mm WHITE ELECTRONIC DESIGNS CORP 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, BGA-255 unknown 3A991.A.2 8542.31.00.01
12345Next