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WE128K32N-250H1IA
Mercury Systems Inc
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Check for Price | Contact Manufacturer | 4.1943 Mbit | 32 | 128KX32 | 5 V | 250 ns | EEPROM MODULE | ALSO CONFIGURABLE AS 512K X 8 | 16 | 1 | 128000 | 131.072 k | SYNCHRONOUS | PARALLEL | 5 V | 250 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 10 ms | S-CPGA-P66 | Not Qualified | 85 °C | -40 °C | 66 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | NO | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.6 mm | 27.3 mm | 27.3 mm | MERCURY SYSTEMS INC | PGA, | compliant | 3A991.B.1.B.1 | 8542.32.00.51 | ||||||
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WE128K32N250H1I
Microsemi Corporation
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Check for Price | Transferred | 4.1943 Mbit | 32 | 128KX32 | 5 V | 250 ns | EEPROM MODULE | ALSO CONFIGURABLE AS 512K X 8 | 16 | 1 | 128000 | 131.072 k | SYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 10 ms | S-CPGA-P66 | Not Qualified | 85 °C | -40 °C | 66 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | NO | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.6 mm | 27.3 mm | 27.3 mm | MICROSEMI CORP | PGA, | unknown | 3A991.B.1.B.1 | 8542.32.00.51 | PGA | 66 | |||||
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WE128K32N-250H1I
Mercury Systems Inc
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Check for Price | Contact Manufacturer | 4.1943 Mbit | 32 | 128KX32 | 5 V | 250 ns | EEPROM MODULE | ALSO CONFIGURABLE AS 512K X 8 | 16 | 1 | 128000 | 131.072 k | SYNCHRONOUS | PARALLEL | 5 V | 250 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 10 ms | S-CPGA-P66 | Not Qualified | 85 °C | -40 °C | 66 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | NO | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.6 mm | 27.3 mm | 27.3 mm | MERCURY SYSTEMS INC | PGA, | unknown | 3A991.B.1.B.1 | 8542.32.00.51 | ||||||
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WE128K32N250H1I
White Electronic Designs Corp
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Check for Price | No | Transferred | 4.1943 Mbit | 32 | 128KX32 | 5 V | 250 ns | EEPROM MODULE | ALSO CONFIGURABLE AS 512K X 8 | 16 | 1 | 128000 | 131.072 k | SYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 10 ms | S-CPGA-P66 | Not Qualified | 85 °C | -40 °C | 66 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | NO | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.6 mm | 27.3 mm | 27.3 mm | WHITE ELECTRONIC DESIGNS CORP | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | unknown | 3A991.B.1.B.1 | 8542.32.00.51 | ||||||
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WE128K32N250H1IA
White Electronic Designs Corp
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Check for Price | No | Transferred | 4.1943 Mbit | 32 | 128KX32 | 5 V | 250 ns | EEPROM MODULE | ALSO CONFIGURABLE AS 512K X 8 | 16 | 1 | 128000 | 131.072 k | SYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 10 ms | S-CPGA-P66 | Not Qualified | 85 °C | -40 °C | 66 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | NO | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.6 mm | 27.3 mm | 27.3 mm | WHITE ELECTRONIC DESIGNS CORP | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | unknown | 3A991.B.1.B.1 | 8542.32.00.51 | ||||||
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WE128K32N-250H1I
Microsemi Corporation
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Check for Price | No | Transferred | 4.1943 Mbit | 32 | 128KX32 | 5 V | 250 ns | EEPROM MODULE | ALSO CONFIGURABLE AS 512K X 8 | 16 | 1 | 128000 | 131.072 k | SYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 10 ms | S-CPGA-P66 | Not Qualified | 85 °C | -40 °C | 66 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | NO | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.6 mm | 27.3 mm | 27.3 mm | MICROSEMI CORP | PGA, | compliant | 3A991.B.1.B.1 | 8542.32.00.51 | PGA | 66 | ||||
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WE128K32N-250H1I
White Microelectronics
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Check for Price | Transferred | 4.1943 Mbit | 32 | 128KX32 | 5 V | 250 ns | EEPROM MODULE | USER CONFIGURABLE AS 512K X 8 | 16 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 10 ms | S-CPGA-P66 | Not Qualified | 85 °C | -40 °C | 66 | CERAMIC, METAL-SEALED COFIRED | SQUARE | GRID ARRAY | NO | PIN/PEG | PERPENDICULAR | WHITE MICROELECTRONICS | CERAMIC, HIP-66 | unknown | 3A991.B.1.B.1 | 8542.32.00.51 | ||||||||||||
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WE128K32N-250H1IA
White Microelectronics
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Check for Price | Transferred | 4.1943 Mbit | 32 | 128KX32 | 5 V | 250 ns | EEPROM MODULE | USER CONFIGURABLE AS 512K X 8 | 16 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 10 ms | S-CPGA-P66 | Not Qualified | 85 °C | -40 °C | 66 | CERAMIC, METAL-SEALED COFIRED | SQUARE | GRID ARRAY | NO | PIN/PEG | PERPENDICULAR | WHITE MICROELECTRONICS | , | unknown | 3A991.B.1.B.1 | 8542.32.00.51 | ||||||||||||
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WE128K32N250H1IA
Microsemi Corporation
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Check for Price | Transferred | 4.1943 Mbit | 32 | 128KX32 | 5 V | 250 ns | EEPROM MODULE | ALSO CONFIGURABLE AS 512K X 8 | 16 | 1 | 128000 | 131.072 k | SYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 10 ms | S-CPGA-P66 | Not Qualified | 85 °C | -40 °C | 66 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | NO | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.6 mm | 27.3 mm | 27.3 mm | MICROSEMI CORP | PGA, | unknown | 3A991.B.1.B.1 | 8542.32.00.51 | PGA | 66 |