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Manufacturer Part Number: w979h2kb
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W979H2KBQX2I
 Winbond Electronics Corp 		Check for Price Yes Active 536.8709 Mbit 32 16MX32 1.2 V FOUR BANK PAGE BURST LPDDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 16000000 16.7772 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS INDUSTRIAL S-PBGA-B168 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 168 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 12 mm 12 mm WINBOND ELECTRONICS CORP VFBGA, compliant EAR99 8542.32.00.28 Winbond
W979H2KBVX1I
 Winbond Electronics Corp 		Check for Price Yes Not Recommended 536.8709 Mbit 32 16MX32 1.2 V FOUR BANK PAGE BURST LPDDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 16000000 16.7772 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS INDUSTRIAL R-PBGA-B134 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 134 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1 mm 11.5 mm 10 mm WINBOND ELECTRONICS CORP VFBGA, compliant EAR99 8542.32.00.28
W979H2KBQX2E
 Winbond Electronics Corp 		Check for Price Yes Active 536.8709 Mbit 32 16MX32 1.2 V FOUR BANK PAGE BURST DDR DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 16000000 16.7772 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS S-PBGA-B168 NOT SPECIFIED NOT SPECIFIED 168 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 12 mm 12 mm WINBOND ELECTRONICS CORP WFBGA-168 compliant EAR99 8542.32.00.28
W979H2KBVX2E
 Winbond Electronics Corp 		Check for Price Yes Not Recommended 536.8709 Mbit 32 16MX32 1.2 V FOUR BANK PAGE BURST LPDDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 16000000 16.7772 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS R-PBGA-B134 NOT SPECIFIED NOT SPECIFIED 134 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1 mm 11.5 mm 10 mm WINBOND ELECTRONICS CORP VFBGA, compliant EAR99 8542.32.00.28
W979H2KBQX1E
 Winbond Electronics Corp 		Check for Price Yes Active 536.8709 Mbit 32 16MX32 1.2 V FOUR BANK PAGE BURST LPDDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 16000000 16.7772 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS S-PBGA-B168 NOT SPECIFIED NOT SPECIFIED 168 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 12 mm 12 mm WINBOND ELECTRONICS CORP VFBGA, compliant EAR99 8542.32.00.28
W979H2KBVX1E
 Winbond Electronics Corp 		Check for Price Yes Not Recommended 536.8709 Mbit 32 16MX32 1.2 V FOUR BANK PAGE BURST LPDDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 16000000 16.7772 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS R-PBGA-B134 NOT SPECIFIED NOT SPECIFIED 134 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1 mm 11.5 mm 10 mm WINBOND ELECTRONICS CORP VFBGA, compliant EAR99 8542.32.00.28
W979H2KBVX2I
 Winbond Electronics Corp 		Check for Price Yes Not Recommended 536.8709 Mbit 32 16MX32 1.2 V FOUR BANK PAGE BURST LPDDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 16000000 16.7772 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS INDUSTRIAL R-PBGA-B134 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 134 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1 mm 11.5 mm 10 mm WINBOND ELECTRONICS CORP VFBGA-134 compliant EAR99 8542.32.00.28 Winbond
W979H2KBQX1I
 Winbond Electronics Corp 		Check for Price Yes Active 536.8709 Mbit 32 16MX32 1.2 V FOUR BANK PAGE BURST LPDDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 16000000 16.7772 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS INDUSTRIAL S-PBGA-B168 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 168 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 12 mm 12 mm WINBOND ELECTRONICS CORP VFBGA, compliant EAR99 8542.32.00.28