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W971GG6JB25K
Winbond Electronics Corp
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Check for Price | Active | 1.0737 Gbit | 64MX16 | 1.8 V | 1.8 V | 400 ps | 400 MHz | 8192 | DDR DRAM | COMMON | 4,8 | 64000000 | 67.1089 M | 3-STATE | 4,8 | 10 mA | 225 µA | CMOS | R-PBGA-B84 | Not Qualified | 84 | PLASTIC/EPOXY | FBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | WINBOND ELECTRONICS CORP | FBGA, BGA84,9X15,32 | unknown | ||||||||||||||||||||||||
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W971GG6JB-25K
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.8 V | 400 ps | 400 MHz | 8192 | MULTI BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 10 mA | 225 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B84 | Not Qualified | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 84 | PLASTIC/EPOXY | TFBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 8 mm | WINBOND ELECTRONICS CORP | TFBGA, BGA84,9X15,32 | compliant | BGA | 84 | EAR99 | 8542.32.00.32 |