Findchips: Parametric Search Results for W72M64V-XBX

Parametric results for: W72M64V-XBX under Flash Memories

Select parts from the table below to compare.

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Select Parts		Part Number

		W72M64V-100BM White Electronic Designs Corp
		W72M64V-120BI White Electronic Designs Corp
		W72M64VK90BI White Electronic Designs Corp
		W72M64VB90BI White Electronic Designs Corp
		W72M64VB90BI Microsemi Corporation
		W72M64V-100BC White Electronic Designs Corp
		W72M64VB120BM Microsemi Corporation
		W72M64VB90BC Microsemi Corporation
		W72M64V-100BI Microsemi Corporation
		W72M64VB100BC Microsemi Corporation

				Most Relevant						Technical																						Compliance		Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Alternate Memory Width	Boot Block	Command User Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	Write Protection	JESD-30 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Obsolete

134.2177 Mbit

2MX64

3.3 V

100 ns

FLASH MODULE

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3.3 V

3.6 V

3 V

CMOS

MILITARY

R-PBGA-B159

Not Qualified

125 °C

-55 °C

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

2.2 mm

22 mm

13 mm

WHITE ELECTRONIC DESIGNS CORP

13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159

unknown

Check for Price

Transferred

134.2177 Mbit

2MX64

3.3 V

120 ns

FLASH MODULE

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3.3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B159

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

2.2 mm

22 mm

13 mm

WHITE ELECTRONIC DESIGNS CORP

13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

134.2177 Mbit

4K,32K

2MX64

3.3 V

90 ns

FLASH MODULE

BOTTOM

YES

8,64

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3.3 V

YES

400 µA

180 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

HARDWARE

R-PBGA-B159

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

BGA159,10X16,50

RECTANGULAR

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

2.2 mm

WHITE ELECTRONIC DESIGNS CORP

13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

268.4355 Mbit

4K,32K

4MX64

3.3 V

90 ns

MEMORY CIRCUIT

BOTTOM

YES

8,64

4000000

4.1943 M

PARALLEL

YES

21 µA

140 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

HARDWARE

R-PBGA-B159

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

BGA159,10X16,50

RECTANGULAR

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

19.05 mm

11.43 mm

WHITE ELECTRONIC DESIGNS CORP

13 X 22 MM, PLASTIC, BGA-159

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

268.4355 Mbit

4MX64

3.3 V

MEMORY CIRCUIT

4000000

4.1943 M

3.6 V

3 V

CMOS

INDUSTRIAL

R-PBGA-B159

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA,

unknown

EAR99

8542.32.00.71

BGA

159

Check for Price

Transferred

134.2177 Mbit

2MX64

3.3 V

100 ns

FLASH MODULE

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3.3 V

3.6 V

3 V

CMOS

COMMERCIAL

NOR TYPE

R-PBGA-B159

Not Qualified

70 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

2.2 mm

22 mm

13 mm

WHITE ELECTRONIC DESIGNS CORP

13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

268.4355 Mbit

4MX64

3.3 V

MEMORY CIRCUIT

4000000

4.1943 M

3.6 V

3 V

CMOS

MILITARY

R-PBGA-B159

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA,

unknown

EAR99

8542.32.00.71

BGA

159

Check for Price

Obsolete

268.4355 Mbit

4MX64

3.3 V

MEMORY CIRCUIT

4000000

4.1943 M

3.6 V

3 V

CMOS

COMMERCIAL

R-PBGA-B159

Not Qualified

70 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA,

unknown

EAR99

8542.32.00.71

BGA

159

Check for Price

Obsolete

134.2177 Mbit

2MX64

3.3 V

100 ns

FLASH MODULE

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3.3 V

3.6 V

3 V

CMOS

INDUSTRIAL

R-PBGA-B159

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA,

compliant

EAR99

8542.32.00.51

BGA

159

Check for Price

Obsolete

268.4355 Mbit

4MX64

3.3 V

MEMORY CIRCUIT

4000000

4.1943 M

3.6 V

3 V

CMOS

COMMERCIAL

R-PBGA-B159

Not Qualified

70 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA,

unknown

EAR99

8542.32.00.71

BGA

159

1 2 3 4 5 Next

Compare

W72M64V-100BM

White Electronic Designs Corp

Check for Price

Obsolete

134.2177 Mbit

2MX64

3.3 V

100 ns

FLASH MODULE

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3.3 V

3.6 V

3 V

CMOS

MILITARY

R-PBGA-B159

Not Qualified

125 °C

-55 °C

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

2.2 mm

22 mm

13 mm

WHITE ELECTRONIC DESIGNS CORP

13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159

unknown

W72M64V-120BI

White Electronic Designs Corp

Check for Price

Transferred

134.2177 Mbit

2MX64

3.3 V

120 ns

FLASH MODULE

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3.3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B159

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

2.2 mm

22 mm

13 mm

WHITE ELECTRONIC DESIGNS CORP

13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159

unknown

EAR99

8542.32.00.51

W72M64VK90BI

White Electronic Designs Corp

Check for Price

Obsolete

134.2177 Mbit

4K,32K

2MX64

3.3 V

90 ns

FLASH MODULE

BOTTOM

YES

8,64

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3.3 V

YES

400 µA

180 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

HARDWARE

R-PBGA-B159

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

BGA159,10X16,50

RECTANGULAR

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

2.2 mm

WHITE ELECTRONIC DESIGNS CORP

13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159

unknown

EAR99

8542.32.00.51

W72M64VB90BI

White Electronic Designs Corp

Check for Price

Transferred

268.4355 Mbit

4K,32K

4MX64

3.3 V

90 ns

MEMORY CIRCUIT

BOTTOM

YES

8,64

4000000

4.1943 M

PARALLEL

YES

21 µA

140 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

HARDWARE

R-PBGA-B159

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

BGA159,10X16,50

RECTANGULAR

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

19.05 mm

11.43 mm

WHITE ELECTRONIC DESIGNS CORP

13 X 22 MM, PLASTIC, BGA-159

unknown

EAR99

8542.32.00.71

W72M64VB90BI

Microsemi Corporation

Check for Price

Obsolete

268.4355 Mbit

4MX64

3.3 V

MEMORY CIRCUIT

4000000

4.1943 M

3.6 V

3 V

CMOS

INDUSTRIAL

R-PBGA-B159

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA,

unknown

EAR99

8542.32.00.71

BGA

159

W72M64V-100BC

White Electronic Designs Corp

Check for Price

Transferred

134.2177 Mbit

2MX64

3.3 V

100 ns

FLASH MODULE

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3.3 V

3.6 V

3 V

CMOS

COMMERCIAL

NOR TYPE

R-PBGA-B159

Not Qualified

70 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

2.2 mm

22 mm

13 mm

WHITE ELECTRONIC DESIGNS CORP

13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159

unknown

EAR99

8542.32.00.51

W72M64VB120BM

Microsemi Corporation

Check for Price

Obsolete

268.4355 Mbit

4MX64

3.3 V

MEMORY CIRCUIT

4000000

4.1943 M

3.6 V

3 V

CMOS

MILITARY

R-PBGA-B159

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA,

unknown

EAR99

8542.32.00.71

BGA

159

W72M64VB90BC

Microsemi Corporation

Check for Price

Obsolete

268.4355 Mbit

4MX64

3.3 V

MEMORY CIRCUIT

4000000

4.1943 M

3.6 V

3 V

CMOS

COMMERCIAL

R-PBGA-B159

Not Qualified

70 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA,

unknown

EAR99

8542.32.00.71

BGA

159

W72M64V-100BI

Microsemi Corporation

Check for Price

Obsolete

134.2177 Mbit

2MX64

3.3 V

100 ns

FLASH MODULE

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3.3 V

3.6 V

3 V

CMOS

INDUSTRIAL

R-PBGA-B159

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA,

compliant

EAR99

8542.32.00.51

BGA

159

W72M64VB100BC

Microsemi Corporation

Check for Price

Obsolete

268.4355 Mbit

4MX64

3.3 V

MEMORY CIRCUIT

4000000

4.1943 M

3.6 V

3 V

CMOS

COMMERCIAL

R-PBGA-B159

Not Qualified

70 °C

NOT SPECIFIED

159

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA,

unknown

EAR99

8542.32.00.71

BGA

159

1 2 3 4 5 Next