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Parametric » Memory » DRAMs

Parametric results for: W631GU6MB-09 under DRAMs

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Select Parts		Part Number

		W631GU6MB09J Winbond Electronics Corp
		W631GU6MB09I Winbond Electronics Corp
		W631GU6MB-09 Winbond Electronics Corp

			Most Relevant					Technical												Compliance	Operating Conditions		Physical									Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Mode	Memory IC Type	Additional Feature	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Self Refresh	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro

Check for Price

Yes

Obsolete

1.0737 Gbit

16

64MX16

1.35 V

MULTI BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

1

1

64000000

67.1089 M

SYNCHRONOUS

YES

1.45 V

1.283 V

CMOS

INDUSTRIAL

R-PBGA-B96

105 °C

-40 °C

96

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

13 mm

7.5 mm

WINBOND ELECTRONICS CORP

VFBGA-96

compliant

EAR99

8542.32.00.32

2017-12-01

Check for Price

Yes

Obsolete

1.0737 Gbit

16

64MX16

1.35 V

MULTI BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

1

1

64000000

67.1089 M

SYNCHRONOUS

YES

1.45 V

1.283 V

CMOS

INDUSTRIAL

R-PBGA-B96

95 °C

-40 °C

96

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

13 mm

7.5 mm

WINBOND ELECTRONICS CORP

VFBGA-96

compliant

EAR99

8542.32.00.32

2017-12-01

Check for Price

Yes

Obsolete

1.0737 Gbit

16

64MX16

1.35 V

MULTI BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

1

1

64000000

67.1089 M

SYNCHRONOUS

YES

1.45 V

1.283 V

CMOS

OTHER

R-PBGA-B96

95 °C

96

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

13 mm

7.5 mm

WINBOND ELECTRONICS CORP

VFBGA-96

compliant

EAR99

8542.32.00.32

2017-12-01

Compare

Winbond Electronics Corp

Check for Price

Yes

Obsolete

1.0737 Gbit

16

64MX16

1.35 V

MULTI BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

1

1

64000000

67.1089 M

SYNCHRONOUS

YES

1.45 V

1.283 V

CMOS

INDUSTRIAL

R-PBGA-B96

105 °C

-40 °C

96

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

13 mm

7.5 mm

WINBOND ELECTRONICS CORP

VFBGA-96

compliant

EAR99

8542.32.00.32

2017-12-01

Winbond Electronics Corp

Check for Price

Yes

Obsolete

1.0737 Gbit

16

64MX16

1.35 V

MULTI BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

1

1

64000000

67.1089 M

SYNCHRONOUS

YES

1.45 V

1.283 V

CMOS

INDUSTRIAL

R-PBGA-B96

95 °C

-40 °C

96

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

13 mm

7.5 mm

WINBOND ELECTRONICS CORP

VFBGA-96

compliant

EAR99

8542.32.00.32

2017-12-01

Winbond Electronics Corp

Check for Price

Yes

Obsolete

1.0737 Gbit

16

64MX16

1.35 V

MULTI BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

1

1

64000000

67.1089 M

SYNCHRONOUS

YES

1.45 V

1.283 V

CMOS

OTHER

R-PBGA-B96

95 °C

96

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

13 mm

7.5 mm

WINBOND ELECTRONICS CORP

VFBGA-96

compliant

EAR99

8542.32.00.32

2017-12-01