Findchips: Parametric Search Results for W631GG6KB-12


Select Parts		Part Number

		W631GG6KB12I Winbond Electronics Corp
		W631GG6KB12A Winbond Electronics Corp
		W631GG6KB12J Winbond Electronics Corp
		W631GG6KB-12 Winbond Electronics Corp
		W631GG6KB12K Winbond Electronics Corp

			Most Relevant								Technical																		Compliance		Operating Conditions				Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Refresh Cycles	Access Mode	Memory IC Type	Additional Feature	I/O Type	Interleaved Burst Length	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Self Refresh	Sequential Burst Length	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$5.8079

Yes

Obsolete

1.0737 Gbit

64MX16

1.5 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3 DRAM

AUTO/SELF REFRESH

COMMON

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

14 mA

400 µA

1.575 V

1.425 V

CMOS

INDUSTRIAL

R-PBGA-B96

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA96,9X16,32

compliant

EAR99

8542.32.00.32

Winbond

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.5 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3 DRAM

AUTO/SELF REFRESH

COMMON

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

14 mA

400 µA

1.575 V

1.425 V

CMOS

INDUSTRIAL

R-PBGA-B96

Not Qualified

95 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA96,9X16,32

compliant

EAR99

8542.32.00.32

Check for Price

Yes

Active

1.0737 Gbit

64MX16

1.5 V

MULTI BANK PAGE BURST

DDR3 DRAM

AUTO/SELF REFRESH

64000000

67.1089 M

SYNCHRONOUS

YES

1.575 V

1.425 V

CMOS

INDUSTRIAL

R-PBGA-B96

105 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

TFBGA,

compliant

EAR99

8542.32.00.32

Winbond

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.5 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3 DRAM

AUTO/SELF REFRESH

COMMON

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

14 mA

400 µA

1.575 V

1.425 V

CMOS

OTHER

R-PBGA-B96

Not Qualified

85 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

WBGA-96

compliant

EAR99

8542.32.00.32

Winbond

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.5 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3 DRAM

AUTO/SELF REFRESH

COMMON

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

14 mA

400 µA

1.575 V

1.425 V

CMOS

INDUSTRIAL

R-PBGA-B96

Not Qualified

105 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA96,9X16,32

compliant

EAR99

8542.32.00.32

Compare

W631GG6KB12I

Winbond Electronics Corp

$5.8079

Yes

Obsolete

1.0737 Gbit

64MX16

1.5 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3 DRAM

AUTO/SELF REFRESH

COMMON

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

14 mA

400 µA

1.575 V

1.425 V

CMOS

INDUSTRIAL

R-PBGA-B96

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA96,9X16,32

compliant

EAR99

8542.32.00.32

Winbond

W631GG6KB12A

Winbond Electronics Corp

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.5 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3 DRAM

AUTO/SELF REFRESH

COMMON

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

14 mA

400 µA

1.575 V

1.425 V

CMOS

INDUSTRIAL

R-PBGA-B96

Not Qualified

95 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA96,9X16,32

compliant

EAR99

8542.32.00.32

W631GG6KB12J

Winbond Electronics Corp

Check for Price

Yes

Active

1.0737 Gbit

64MX16

1.5 V

MULTI BANK PAGE BURST

DDR3 DRAM

AUTO/SELF REFRESH

64000000

67.1089 M

SYNCHRONOUS

YES

1.575 V

1.425 V

CMOS

INDUSTRIAL

R-PBGA-B96

105 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

TFBGA,

compliant

EAR99

8542.32.00.32

Winbond

W631GG6KB-12

Winbond Electronics Corp

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.5 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3 DRAM

AUTO/SELF REFRESH

COMMON

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

14 mA

400 µA

1.575 V

1.425 V

CMOS

OTHER

R-PBGA-B96

Not Qualified

85 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

WBGA-96

compliant

EAR99

8542.32.00.32

Winbond

W631GG6KB12K

Winbond Electronics Corp

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.5 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3 DRAM

AUTO/SELF REFRESH

COMMON

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

14 mA

400 µA

1.575 V

1.425 V

CMOS

INDUSTRIAL

R-PBGA-B96

Not Qualified

105 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA96,9X16,32

compliant

EAR99

8542.32.00.32

Parametric results for: W631GG6KB-12 under DRAMs