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W29GL256SH9B
Winbond Electronics Corp
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W29GL256SH9C
Winbond Electronics Corp
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W29GL256SL9T
Winbond Electronics Corp
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W29GL256SL9B
Winbond Electronics Corp
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W29GL256SL9C
Winbond Electronics Corp
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W29GL256SH9T
Winbond Electronics Corp
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||
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Supply Voltage-Nom (Vsup)
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Number of Words Code | Number of Words |
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HTS Code
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Samacsys Manufacturer
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Yes | Obsolete | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | FLASH | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | WINBOND ELECTRONICS CORP | LFBGA-64 | compliant | EAR99 | 8542.32.00.51 | ||
Yes | Obsolete | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | FLASH | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B56 | Not Qualified | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | TFBGA | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | WINBOND ELECTRONICS CORP | TFBGA-56 | compliant | EAR99 | 8542.32.00.51 | Winbond | |
Yes | Obsolete | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | FLASH | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | WINBOND ELECTRONICS CORP | TSOP-56 | compliant | EAR99 | 8542.32.00.51 | ||
Yes | Obsolete | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | FLASH | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | WINBOND ELECTRONICS CORP | LFBGA-64 | compliant | EAR99 | 8542.32.00.51 | ||
Yes | Obsolete | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | FLASH | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B56 | Not Qualified | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | TFBGA | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | WINBOND ELECTRONICS CORP | TFBGA-56 | compliant | EAR99 | 8542.32.00.51 | ||
Yes | Obsolete | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | FLASH | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | WINBOND ELECTRONICS CORP | TSOP-56 | compliant | EAR99 | 8542.32.00.51 |
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W29GL256SH9B
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | FLASH | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | WINBOND ELECTRONICS CORP | LFBGA-64 | compliant | EAR99 | 8542.32.00.51 | |||
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W29GL256SH9C
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | FLASH | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B56 | Not Qualified | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | TFBGA | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | WINBOND ELECTRONICS CORP | TFBGA-56 | compliant | EAR99 | 8542.32.00.51 | Winbond | ||
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W29GL256SL9T
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | FLASH | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | WINBOND ELECTRONICS CORP | TSOP-56 | compliant | EAR99 | 8542.32.00.51 | |||
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W29GL256SL9B
Winbond Electronics Corp
|
Check for Price | Yes | Obsolete | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | FLASH | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | WINBOND ELECTRONICS CORP | LFBGA-64 | compliant | EAR99 | 8542.32.00.51 | |||
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W29GL256SL9C
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | FLASH | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B56 | Not Qualified | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | TFBGA | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | WINBOND ELECTRONICS CORP | TFBGA-56 | compliant | EAR99 | 8542.32.00.51 | |||
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W29GL256SH9T
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | FLASH | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | WINBOND ELECTRONICS CORP | TSOP-56 | compliant | EAR99 | 8542.32.00.51 |