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Parametric results for: W27E040 under EEPROMs

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Manufacturer Part Number: w27e040
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W27E040-90
 Winbond Electronics Corp 		Check for Price No Obsolete 4.1943 Mbit 8 512KX8 5 V 90 ns EEPROM NO NO 1 512000 524.288 k ASYNCHRONOUS PARALLEL 12 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL NO R-PDIP-T32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY DIP DIP32,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.33 mm 41.91 mm 15.24 mm WINBOND ELECTRONICS CORP DIP DIP, DIP32,.6 32 unknown 3A991.B.1.B.1 8542.32.00.51
W27E040S-90
 Winbond Electronics Corp 		Check for Price No Obsolete 4.1943 Mbit 8 512KX8 5 V 90 ns EEPROM NO NO 1 512000 524.288 k ASYNCHRONOUS PARALLEL 12 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL NO R-PDSO-G32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY SOP SOP32,.56 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 3 mm 20.45 mm 11.3 mm WINBOND ELECTRONICS CORP SOIC SOP, SOP32,.56 32 not_compliant 3A991.B.1.B.1 8542.32.00.51
W27E040P-12
 Winbond Electronics Corp 		Check for Price No Obsolete 4.1943 Mbit 8 512KX8 5 V 120 ns EEPROM NO NO 1 512000 524.288 k ASYNCHRONOUS PARALLEL 12 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL NO R-PQCC-N32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY QCCN LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD NO LEAD 1.27 mm QUAD 3.56 mm 13.97 mm 11.43 mm WINBOND ELECTRONICS CORP QFJ QCCN, LDCC32,.5X.6 32 unknown 3A991.B.1.B.1 8542.32.00.51
W27E040T-90
 Winbond Electronics Corp 		Check for Price No Obsolete 4.1943 Mbit 8 512KX8 5 V 90 ns EEPROM NO NO 1 512000 524.288 k ASYNCHRONOUS PARALLEL 12 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL NO R-PDSO-G32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY TSOP1 TSSOP32,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 8 mm WINBOND ELECTRONICS CORP TSOP1 TSOP1, TSSOP32,.8,20 32 unknown 3A991.B.1.B.1 8542.32.00.51
W27E040T-12
 Winbond Electronics Corp 		Check for Price No Obsolete 4.1943 Mbit 8 512KX8 5 V 120 ns EEPROM NO NO 1 512000 524.288 k ASYNCHRONOUS PARALLEL 12 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL NO R-PDSO-G32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY TSOP1 TSSOP32,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 8 mm WINBOND ELECTRONICS CORP TSOP1 TSOP1, TSSOP32,.8,20 32 unknown 3A991.B.1.B.1 8542.32.00.51
W27E040-12
 Winbond Electronics Corp 		Check for Price No Obsolete 4.1943 Mbit 8 512KX8 5 V 120 ns EEPROM NO NO 1 512000 524.288 k ASYNCHRONOUS PARALLEL 12 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL NO R-PDIP-T32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY DIP DIP32,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.33 mm 41.91 mm 15.24 mm WINBOND ELECTRONICS CORP DIP DIP, DIP32,.6 32 unknown 3A991.B.1.B.1 8542.32.00.51
W27E040P-90
 Winbond Electronics Corp 		Check for Price No Obsolete 4.1943 Mbit 8 512KX8 5 V 90 ns EEPROM NO NO 1 512000 524.288 k ASYNCHRONOUS PARALLEL 12 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL NO R-PQCC-N32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY QCCN LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD NO LEAD 1.27 mm QUAD 3.56 mm 13.97 mm 11.43 mm WINBOND ELECTRONICS CORP QFJ QCCN, LDCC32,.5X.6 32 unknown 3A991.B.1.B.1 8542.32.00.51
W27E040S-12
 Winbond Electronics Corp 		Check for Price No Obsolete 4.1943 Mbit 8 512KX8 5 V 120 ns EEPROM NO NO 1 512000 524.288 k ASYNCHRONOUS PARALLEL 12 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL NO R-PDSO-G32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY SOP SOP32,.56 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 3 mm 20.45 mm 11.3 mm WINBOND ELECTRONICS CORP SOIC SOP, SOP32,.56 32 not_compliant 3A991.B.1.B.1 8542.32.00.51