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W27E010S-45
Winbond Electronics Corp
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Check for Price | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 45 ns | EEPROM | NO | NO | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 12 V | 100 µA | 30 µA | 5.25 V | 4.75 V | CMOS | COMMERCIAL | NO | R-PDSO-G32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | SOP | SOP32,.56 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3 mm | 20.45 mm | 11.3 mm | WINBOND ELECTRONICS CORP | SOIC | SOP, SOP32,.56 | 32 | not_compliant | 3A991.B.1.B.2 | 8542.32.00.51 | |||
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W27E010P-90
Winbond Electronics Corp
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Check for Price | No | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 90 ns | EEPROM | NO | NO | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 12 V | 100 µA | 30 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | NO | R-PQCC-J32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.56 mm | 13.97 mm | 11.43 mm | WINBOND ELECTRONICS CORP | QFJ | PLASTIC, LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.51 | ||
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W27E010S-12
Winbond Electronics Corp
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Check for Price | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 120 ns | EEPROM | NO | NO | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 12 V | 100 µA | 30 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | NO | R-PDSO-G32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | SOP | SOP32,.56 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3 mm | 20.45 mm | 11.3 mm | WINBOND ELECTRONICS CORP | SOIC | 0.450 INCH, SOP-32 | 32 | not_compliant | EAR99 | 8542.32.00.51 | |||
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W27E010S-55
Winbond Electronics Corp
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Check for Price | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 55 ns | EEPROM | NO | NO | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 12 V | 100 µA | 30 µA | 5.25 V | 4.75 V | CMOS | COMMERCIAL | NO | R-PDSO-G32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | SOP | SOP32,.56 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3 mm | 20.45 mm | 11.3 mm | WINBOND ELECTRONICS CORP | SOIC | SOP, SOP32,.56 | 32 | not_compliant | 3A991.B.1.B.2 | 8542.32.00.51 | |||
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W27E010-12
Winbond Electronics Corp
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Check for Price | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 120 ns | EEPROM | NO | NO | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 12 V | 100 µA | 30 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | NO | R-PDIP-T32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.33 mm | 41.91 mm | 15.24 mm | WINBOND ELECTRONICS CORP | DIP | 0.600 INCH, PLASTIC, DIP-32 | 32 | not_compliant | EAR99 | 8542.32.00.51 | |||
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W27E010P-55
Winbond Electronics Corp
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Check for Price | No | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 55 ns | EEPROM | NO | NO | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 12 V | 100 µA | 30 µA | 5.25 V | 4.75 V | CMOS | COMMERCIAL | NO | R-PQCC-J32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.56 mm | 13.97 mm | 11.43 mm | WINBOND ELECTRONICS CORP | QFJ | QCCJ, LDCC32,.5X.6 | 32 | not_compliant | 3A991.B.1.B.2 | 8542.32.00.51 | ||
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W27E010S-70
Winbond Electronics Corp
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Check for Price | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 70 ns | EEPROM | NO | NO | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 12 V | 100 µA | 30 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | NO | R-PDSO-G32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | SOP | SOP32,.56 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3 mm | 20.45 mm | 11.3 mm | WINBOND ELECTRONICS CORP | SOIC | 0.450 INCH, SOP-32 | 32 | not_compliant | 3A991.B.1.B.2 | 8542.32.00.51 | |||
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W27E010-55
Winbond Electronics Corp
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Check for Price | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 55 ns | EEPROM | NO | NO | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 12 V | 100 µA | 30 µA | 5.25 V | 4.75 V | CMOS | COMMERCIAL | NO | R-PDIP-T32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.33 mm | 41.91 mm | 15.24 mm | WINBOND ELECTRONICS CORP | DIP | DIP, DIP32,.6 | 32 | not_compliant | 3A991.B.1.B.2 | 8542.32.00.51 | |||
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W27E010P-12
Winbond Electronics Corp
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Check for Price | No | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 120 ns | EEPROM | NO | NO | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 12 V | 100 µA | 30 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | NO | R-PQCC-J32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.56 mm | 13.97 mm | 11.43 mm | WINBOND ELECTRONICS CORP | QFJ | PLASTIC, LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.51 | ||
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W27E010-70
Winbond Electronics Corp
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Check for Price | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 70 ns | EEPROM | NO | NO | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 12 V | 100 µA | 30 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | NO | R-PDIP-T32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.33 mm | 41.91 mm | 15.24 mm | WINBOND ELECTRONICS CORP | DIP | 0.600 INCH, PLASTIC, DIP-32 | 32 | not_compliant | 3A991.B.1.B.2 | 8542.32.00.51 |