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W25Q64FVDAIQ
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 3 V | 104 MHz | FLASH | 1 | 20 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 50 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | HARDWARE/SOFTWARE | R-PDIP-T8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.33 mm | 9.27 mm | 7.62 mm | WINBOND ELECTRONICS CORP | DIP-8 | compliant | EAR99 | 8542.32.00.51 | Winbond | |||||
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W25Q64FVZPIF
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 3 V | 104 MHz | FLASH | 1 | 20 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 50 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HSON | SOLCC8,.2 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | WINBOND ELECTRONICS CORP | WSON-8 | compliant | EAR99 | 8542.32.00.51 | Winbond | |||||
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W25Q64FVSTIF
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 3 V | 104 MHz | FLASH | 1 | 20 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 50 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | HARDWARE/SOFTWARE | S-PDSO-G8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | VSOP | SOP8,.3 | SQUARE | SMALL OUTLINE, VERY THIN PROFILE | YES | GULL WING | 1.27 mm | DUAL | 1 mm | 5.28 mm | 5.28 mm | WINBOND ELECTRONICS CORP | VSOP, SOP8,.3 | compliant | EAR99 | 8542.32.00.51 | ||||||
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W25Q64FVSTIP
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 25 µA | 40 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | S-PDSO-G8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | VSOP | TSOP8,.3 | SQUARE | SMALL OUTLINE, VERY THIN PROFILE | YES | GULL WING | 1.27 mm | DUAL | 1 mm | 5.28 mm | 5.28 mm | WINBOND ELECTRONICS CORP | VSOP, TSOP8,.3 | compliant | EAR99 | 8542.32.00.51 | ||||
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W25Q64FVZPIP
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 25 µA | 40 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | WINBOND ELECTRONICS CORP | HVSON, SOLCC8,.25 | compliant | EAR99 | 8542.32.00.51 | ||||
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W25Q64FVSFIF
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 3 V | 104 MHz | FLASH | 1 | 20 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 50 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.64 mm | 10.31 mm | 7.49 mm | WINBOND ELECTRONICS CORP | SOIC-16 | compliant | EAR99 | 8542.32.00.51 | ||||||
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W25Q64FVBYIF
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 3 V | 104 MHz | FLASH | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B16 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 512 µm | 3.43 mm | 2.36 mm | WINBOND ELECTRONICS CORP | GREEN, WLBGA-16 | compliant | EAR99 | 8542.32.00.51 | ||||||||||||
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W25Q64FVSFIQ
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 3 V | 104 MHz | FLASH | 1 | 20 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 50 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.64 mm | 10.31 mm | 7.49 mm | WINBOND ELECTRONICS CORP | SOIC-16 | compliant | EAR99 | 8542.32.00.51 | Winbond | |||||
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W25Q64FVXGIQ
Winbond Electronics Corp
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Check for Price | Yes | Not Recommended | 67.1089 Mbit | 8 | 8MX8 | 3 V | 104 MHz | FLASH | 1 | 20 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 50 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | HARDWARE/SOFTWARE | S-PDSO-N8 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HSON | SOLCC8,.3 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG | YES | NO LEAD | 800 µm | DUAL | 500 µm | 4 mm | 4 mm | WINBOND ELECTRONICS CORP | HSON, SOLCC8,.3 | compliant | EAR99 | 8542.32.00.51 | |||||||
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W25Q64FVZEIF
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 3 V | 104 MHz | FLASH | 1 | 20 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 50 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | WINBOND ELECTRONICS CORP | WSON-8 | compliant | EAR99 | 8542.32.00.51 | Winbond |