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UPD23C32300F9-XXX-BC3-A
NEC Electronics America Inc
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 16 | 4MX16 | 3.3 V | 100 ns | MASK ROM | 8 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 50 µA | MOS | COMMERCIAL | R-PBGA-B48 | Not Qualified | e3/e6 | 70 °C | -10 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | MATTE TIN/TIN BISMUTH | BALL | 800 µm | BOTTOM | 1.07 mm | 8 mm | 6 mm | NEC ELECTRONICS AMERICA INC | 8 X 6 MM, LEAD FREE, FBGA-48 | compliant | EAR99 | 8542.32.00.71 | ||||
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UPD23C32300F9-XXX-BC3
NEC Electronics Group
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Check for Price | No | Obsolete | 67.1089 Mbit | 16 | 4MX16 | 3.3 V | 120 ns | MASK ROM | 8 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 50 µA | MOS | COMMERCIAL | R-PBGA-B48 | Not Qualified | e0 | 70 °C | -10 °C | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.07 mm | 8 mm | 6 mm | NEC ELECTRONICS CORP | 8 X 6 MM, FBGA-48 | compliant | EAR99 | 8542.32.00.71 | BGA | 48 |