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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: TSXPC860SRVZPU/T40D under Microprocessors

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	Part Number

Microcontrollers and Processors

TSXPC860SRVZPU/T40D

Atmel Corporation

			Most Relevant							Technical									Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

No

Obsolete

32

40 MHz

32

32

40 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

INDUSTRIAL

S-PBGA-B357

Not Qualified

e0

110 °C

-40 °C

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.05 mm

25 mm

25 mm

ATMEL CORP

BGA

BGA, BGA357,19X19,50

357

compliant

3A991.A.2

8542.31.00.01

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Microcontrollers and Processors

TSXPC860SRVZPU/T40D

Atmel Corporation

Check for Price

No

Obsolete

32

40 MHz

32

32

40 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

INDUSTRIAL

S-PBGA-B357

Not Qualified

e0

110 °C

-40 °C

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.05 mm

25 mm

25 mm

ATMEL CORP

BGA

BGA, BGA357,19X19,50

357

compliant

3A991.A.2

8542.31.00.01